Local gold plating method for metal packaging shell and packaging shell prepared by using local gold plating method
A local gold-plating and metal packaging technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as increased production costs, achieve reduced manufacturing costs, shortened manufacturing processes, and improved The effect of package reliability
Active Publication Date: 2022-04-29
HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This process is to bury a thin layer of gold in the base to prevent displacement. This process is not suitable for the shell of the laser sealing and welding cover, and the burying of a thin layer of gold on the base will also increase the production cost.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0042] Such as Figure 1-3 As shown, a method of partially gold-plating a metal package shell, the package shell 10 includes a base 11, a lead hole 12 is provided on the base 11, a shell lead 13 is inserted through the lead hole, and a surrounding shell lead 13 is also provided in the lead hole 12 The insulator 14.
[0043] The metal package is partially gold-plated, and the method includes the following steps:
[0044] S1. Nickel plating, electrifying the base 11 and the shell lead 13, and nickel-plating the package shell 10 as a whole to form a nickel layer:
[0045]S11. Impact nickel, after the base 11 and the shell lead wire 13 are energized, the package shell 10 is placed in the impact nickel solution, and the solution temperature is 30-60°C, and the plating is performed for 0.5-2min, which is used to strengthen the combination of the nickel layer and the material of the package shell 10 force. After the plating is finished, turn off the power and take it out, wash the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| quality score | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to the technical field of packaging surface treatment, in particular to a local gold plating method for a metal packaging shell and the packaging shell prepared through the local gold plating method. The packaging shell comprises a base, a lead hole is formed in the base, a shell lead is arranged in the lead hole in a penetrating mode, and an insulator surrounding the shell lead is further arranged in the lead hole. The method comprises the steps of nickel plating, oxidation, gold plating, reduction and the like, a nickel layer on the surface of a base is oxidized to slow down the replacement reaction with a gold plating solution, and the stability of a packaging shell is improved. The base of the packaging shell prepared through the local gold plating method does not contain a buried gold plating layer or a chemical nickel plating layer, the sealing cover requirements of laser welding, parallel sealing welding and the like can be met, the preparation technological process of the packaging shell is obviously shortened, the manufacturing cost is obviously reduced, and the application prospect is wide.
Description
technical field [0001] The invention relates to the technical field of package surface treatment, in particular to a partial gold plating method for a metal package shell and a package shell prepared by the method. Background technique [0002] The metal package shell is generally composed of a shell base, leads and insulators. Generally speaking, internal electronic components such as chips and capacitors need to be soldered in the base of the shell. If the base is plated with gold, gold brittleness may occur after long-term use after soldering, which will reduce the reliability of soldering and affect the reliability of the entire packaged components. The shell lead is gold-plated to ensure the bonding strength and solderability of the lead. Different from the parallel sealing and welding capping technology, the sealing and welding surface of the metal package shell of laser capping cannot contain a gold-plated layer. The existence of the gold-plated layer will reduce the...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D5/48C25D11/34C25D3/48C25D5/14C25D5/02C25D7/04C25D5/34H01L21/48H01L23/045H01L23/06
CPCC25D3/12C25D5/48C25D11/34C25D3/48C25D5/14C25D5/02C25D7/04C25D5/34H01L21/4817H01L23/045H01L23/06C25D5/12C25D7/00C25D3/14C25D13/18
Inventor 马骁杨磊陈华三唐正生孙金周波王明龙
Owner HEFEI SHENGDA ELECTRONIC TECH IND CO LTD