Wafer script setting method and device, equipment and storage medium
A setting method and wafer technology, applied in computer-aided design, comprehensive factory control, instruments, etc., can solve the problems of wafer scrapping risk, long time consumption, etc., to avoid the risk of batch scrapping and realize the effect of short process
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[0076] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of methods and apparatus consistent with aspects of the present application as recited in the appended claims.
[0077] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of this application and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application describe...
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