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Wafer script setting method and device, equipment and storage medium

A setting method and wafer technology, applied in computer-aided design, comprehensive factory control, instruments, etc., can solve the problems of wafer scrapping risk, long time consumption, etc., to avoid the risk of batch scrapping and realize the effect of short process

Pending Publication Date: 2022-05-06
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present application provides a wafer script setting method, device, equipment, and storage medium, which are used to solve the problem that the existing wafer execution script setting scheme takes a long time to change the wafer script and has the risk of wafer scrapping As well as technical issues that affect the overall performance of the production system

Method used

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  • Wafer script setting method and device, equipment and storage medium
  • Wafer script setting method and device, equipment and storage medium
  • Wafer script setting method and device, equipment and storage medium

Examples

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Embodiment Construction

[0076] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of methods and apparatus consistent with aspects of the present application as recited in the appended claims.

[0077] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of this application and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application describe...

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PUM

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Abstract

The invention provides a wafer script setting method and device, equipment and a storage medium. If the demand unit determines that the execution necessary condition of the script to be executed meets the business demand according to the parameter information, the platform unit obtains a batch identifier of the script to be executed and corresponding production information, and determines that a wafer corresponding to the script to be executed executes the script to be executed for the first time in the demand unit; and the platform unit checks whether the first production information corresponding to the first wafer meets the execution necessary condition or not, and if yes, the platform unit sets parameter information and assignment information for the first wafer and synchronizes the first wafer with the set information to the material execution unit, so that the material execution unit executes corresponding operation. According to the technical scheme, the script to be executed can be set in real time without modifying the script process, the script to be executed which does not meet the execution necessary condition is avoided from the source, the risk that wafers are scrapped in batches is avoided, the setting process is irrelevant to the batch number, and the overall production efficiency is not affected.

Description

technical field [0001] The present application relates to the technical field of integrated circuits and semiconductors, and in particular to a wafer script setting method, device, equipment and storage medium. Background technique [0002] With the rapid development of computer technology and Internet technology, the integrated circuit industry is ushering in a period of important opportunities and challenges for development. In the actual production conditions of wafers, due to business needs, demand applicants often need to adjust wafer execution scripts according to actual conditions, so as to propose modification requirements to the setters of the execution scripts. [0003] In the prior art, when a requirement applicant proposes to modify the requirement, the setter needs to execute scripts corresponding to the requirement change. And when changing the execution script, only modify it according to the batch identification provided by the request applicant. Not only ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/398
CPCG06F30/398G05B19/418Y02P90/02
Inventor 苏笙华谢明宏
Owner CHANGXIN MEMORY TECH INC
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