Unlock instant, AI-driven research and patent intelligence for your innovation.

Printed circuit board and fluid heater

A printed circuit board, fluid technology, applied in the field of fluid heaters, can solve complex, high semiconductor prices, expensive and other problems

Pending Publication Date: 2022-05-06
DAVID & BAADER DBK
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem with this solution is that the heat generated by the power semiconductors is only generated at specific points in relation to the overall heat transfer surface, making it a lot of work to design the heat distribution elements accordingly to achieve surface heat transfer
In addition, the technica

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and fluid heater
  • Printed circuit board and fluid heater
  • Printed circuit board and fluid heater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] figure 1 A three-dimensional view is shown of a first configuration example of a fluid heater 1 according to the invention, eg a high-pressure heater, eg for heating water or another liquid. The fluid heater 1 has a multi-part housing 2 with a central part 4 and in accordance with figure 1 There are upper and lower covers 6, 8 in the view. The housing 2 delimits a fluid compartment for holding a fluid to be heated, which will be discussed below. Two fluid connections 10 , 12 lead into the fluid compartment, for example, wherein the fluid connection 10 can be configured as an inlet and the fluid connection 12 can be configured as an outlet. Both connections 10, 12 are connected to a piping system for carrying the fluid to be heated. In the embodiment shown, the fluid connections 10 , 12 are configured as connector nozzles on the central part 4 . Of course, these connections can also be provided on the cover side.

[0036] The housing 2 according to the invention als...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a printed circuit board comprising a heating circuit formed by conductive tracks, and a heater comprising such a printed circuit board.

Description

technical field [0001] The invention relates to a printed circuit board according to the preamble of patent claim 1 and to a fluid heater constructed with such a printed circuit board. Background technique [0002] Such fluid heaters are preferably used for heating gaseous or liquid media, such as air or water. The basic design of these fluid heaters is described, for example, in document DE 10 2016 122 767 A1 in the name of the applicant. The fluid heater is configured for heating air and has a heating element configured as a tubular heating element whose heat is transferred to the fluid via a heat exchanger (also referred to as a heat distribution element). In the fluid heater described in detail in DE 10 2016 122 767 A1, the heat distribution element is configured as a metal sponge or as a wire mesh / wire mesh, wherein the fluid flows through holes or ducts formed thereby. Of course, other distribution elements such as extruded profiles or corrugated ribs can also be use...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02H05K3/02H05B3/26H05B3/82F24H1/12F24H9/00F24H9/1818F24H9/20
CPCH05K1/0201H05K3/02H05B3/262H05B3/82F24H9/1818F24H1/121F24H9/2028F24H9/0015H05B2203/021H05B2203/013H05K1/0212F24H15/212F24H15/37F24H15/407
Inventor 塞巴斯蒂安·舍奈希亚历山大·克拉默西蒙·菲舍尔
Owner DAVID & BAADER DBK