Re-doped copper-tin alloy contact wire and preparation method thereof

A technology of copper-tin alloy and contact wire, which is applied in the direction of metal/alloy conductors, conductors, conductive materials, etc., can solve problems such as loss, achieve the goals of improving organizational structure, eliminating cast dendrite structure, and refining cast rod grains Effect

Pending Publication Date: 2022-05-13
武汉正威新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to obtain a high level of alloy performance matching and adapt to the continuous plastic processing requirements under mass production conditions, trace elements such as Ag, Mg, Mn, Sn, etc. are usually added to copper, and solid solution strengthening is used to achieve a limited reduction in electrical conductivity. The strength of the material; or the use of large deformation strengthening technology to increase the amount of deformation to achieve the effect of increasing the strength; but the strength obtained by the latter is easy to lose due to heat or natural aging during the use of the product

Method used

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  • Re-doped copper-tin alloy contact wire and preparation method thereof
  • Re-doped copper-tin alloy contact wire and preparation method thereof
  • Re-doped copper-tin alloy contact wire and preparation method thereof

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Embodiment Construction

[0018] The principles and features of the present invention are described below, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0019] 1. Alloy composition

[0020] 1.1 Copper-tin alloy composition

[0021] Copper alloy materials are electrolytic copper, tin ingot and rare earth master alloy. Standard cathode copper is used, the composition is: 99.00%; tin ingot (chemical composition: Sn≥90.90%), the rare earth is added as La-Ce mixed rare earth (master alloy); B is added as master alloy. Table 1 is the composition of the copper-tin alloy used in this patent.

[0022] Table 1 Copper-tin alloy composition

[0023] alloy Re B sn Cu Impurities (less than) Cu-Sn - - 0.3 margin 0.1 Cu-Sn-B 0.05 0.25 margin 0.1 Cu-Sn-Re 0.05 - 0.25 margin 0.1

[0024] 1.2 Ingredients Calculation

[0025] When formulating alloys, Cu and Sn all use ne...

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Abstract

The invention belongs to the technical field of copper-tin alloy contact wires, and particularly relates to a Re-doped copper-tin alloy contact wire and a preparation method thereof. In the casting process of the copper-tin alloy, Re is added through a holding furnace, then continuous casting is conducted to form an up-drawing copper rod, then the up-drawing copper rod is extruded into a rod to be stretched through a continuous extrusion technology, finally, the Re-doped copper-tin alloy contact wire with the total component of Cu-Sn-Re is obtained through a four-die continuous stretching technology, and the adding amount of Re accounts for 0.05-0.09% of the weight of the obtained Re-doped copper-tin alloy. The trace Re is added in the casting process, so that the organization structure of the CuSn alloy up-drawing rod can be obviously improved, crystal grains of the casting rod can be refined, and the tensile strength and the electric conductivity of the casting rod can be improved. And meanwhile, after trace Re is added, the occurrence of various defects in the continuous casting process is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of copper-tin alloy contact wires, and in particular relates to a heat-doped copper-tin alloy contact wire and a preparation method thereof. Background technique [0002] With the continuous progress of science and technology and social economy. Electrified railways are gradually developing towards high-speed and heavy-duty directions, and contact wires are required to have high tensile strength, excellent electrical conductivity, and certain heat resistance and wear resistance. Copper alloys have always had a conflict between high strength and high electrical conductivity. In order to obtain a high level of alloy performance matching and adapt to the continuous plastic processing requirements under mass production conditions, trace elements such as Ag, Mg, Mn, Sn, etc. are usually added to copper, and solid solution strengthening is used to achieve a limited reduction in electrical conductivity. The stren...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/04B21C1/00B21C23/00B22D11/00B22D11/04H01B1/02
CPCB21C37/045B21C23/002B21C1/003B22D11/004B22D11/04H01B1/026
Inventor 李枭
Owner 武汉正威新材料科技有限公司
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