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Implementation method based on semiconductor chilling plate

An implementation method and technology of refrigeration sheets, which are applied in the manufacture of semiconductor/solid-state devices, the manufacture/processing of thermoelectric devices, electrical components, etc., can solve the problems of difficult and high ZT value.

Active Publication Date: 2022-05-13
龙蔚电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a certain material, its Seebeck coefficient α, electrical conductivity σ, and thermal conductivity λ are three parameters that determine the thermoelectric properties of the material are coupled and restricted, and it is difficult to fundamentally improve the ZT value.

Method used

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  • Implementation method based on semiconductor chilling plate
  • Implementation method based on semiconductor chilling plate
  • Implementation method based on semiconductor chilling plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] The present invention provides a kind of realization method based on semi-conductor refrigerating sheet, such as figure 1 shown, including:

[0079] Step 1: Obtain the production requirements for making refrigeration chips, and analyze the production requirements;

[0080] Step 2: According to the analysis results, judge whether it is necessary to make conventional semiconductors. If so, conduct simulation modeling according to the conventional production process to obtain conventional refrigeration chips and carry out actual production;

[0081] Otherwise, obtain the production list, and the production list includes several production structures, and determine the improved production process according to the structural attributes of each production structure;

[0082] Step 3: Carry out simulation construction according to the improved production process, and obtain improved refrigeration chips;

[0083] Step 4: Carry out a simulation test on each first structure in t...

Embodiment 2

[0093] Based on Example 1, after analyzing the production requirements, it also includes:

[0094] According to the analysis results, it is judged that the production conditions that the production needs meet are met, and when the conventional production conditions are met, it is determined that it is necessary to build a conventional refrigeration sheet;

[0095] When the improvement manufacturing conditions are met, it is determined that an improved refrigeration sheet needs to be constructed.

[0096] The beneficial effect of the above-mentioned technical solution is: by determining the type of refrigerating sheet to be constructed, subsequent operations can be effectively performed.

Embodiment 3

[0098] Based on the basis of embodiment 1, such as figure 2 As shown, the improved refrigeration sheet includes:

[0099] A plurality of semiconductor cooling chip units, each cooling chip unit includes a cold end substrate 1 and a hot end substrate 11;

[0100] The lower surface of the cold-end substrate 1 is provided with a cold-end conductive plate 2, and the upper surface of the hot-end substrate 11 is respectively provided with a hot-end conductive plate 10 and a hot-end conductive plate 7;

[0101] One end of the N-type thermoelectric arm 8 is connected to the cold-end conductive plate 2 through the Schottky barrier contact layer 3, and the other end of the N-type thermoelectric arm 8 is connected to the hot-end conductive plate 10 through the ohmic contact layer 9;

[0102] One end of the P-type thermoelectric arm 5 is connected to the cold-end conductive plate 2 through the Schottky barrier contact layer 4 , and the other end of the P-type thermoelectric arm 5 is conne...

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PUM

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Abstract

The invention provides an implementation method based on a semiconductor chilling plate, and the method comprises the steps: 1, obtaining a manufacturing demand for manufacturing the chilling plate, and analyzing the manufacturing demand; 2, according to the analysis result, whether a conventional semiconductor needs to be manufactured or not is judged, if yes, simulation modeling is carried out according to a conventional manufacturing process, a conventional refrigeration sheet is obtained, and actual manufacturing is carried out; otherwise, a manufacturing list is obtained, the manufacturing list comprises a plurality of manufacturing structures, and an improved manufacturing process is determined according to the structure attribute of each manufacturing structure; 3, simulation construction is conducted according to the improved manufacturing process, and an improved refrigeration sheet is obtained; and 4, performing simulation detection on each first structure in the improved refrigeration sheet, obtaining a first refrigeration sheet after the simulation detection is qualified, performing actual manufacturing to obtain a second refrigeration sheet, and performing actual detection on the actual manufacturing process of the second refrigeration sheet and the second refrigeration sheet. And the manufacturing effectiveness and the subsequent use effectiveness of the refrigeration sheet are effectively ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor refrigeration, in particular to an implementation method based on semiconductor refrigeration chips. Background technique [0002] Thermoelectric conversion technology is a technology that uses the Seebeck effect and Peltier effect of materials to directly convert heat and electricity, including thermoelectric power generation and thermoelectric refrigeration. This technology has the characteristics of small system size, high reliability, no emission of pollutants, and wide applicable temperature range. As a special power supply and high-precision temperature control device, it has been widely used in high-tech fields such as space technology, military equipment, and information technology. Although thermoelectric materials have so many advantages and are expected to play a huge role in all aspects of human life, the conversion efficiency of existing thermoelectric materials is still relati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/34H01L21/67H10N10/01
CPCH01L21/67276H10N10/01
Inventor 杨以凡夏先齐汤艳龙潘能兵
Owner 龙蔚电子技术有限公司