5G precision circuit board back drilling hole depth control method

A technology of drilling depth and back-drilling, which is used in printed circuits, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as affecting product progress and delivery time, wasting time, and costing more, so as to reduce scratches risk, reduce online time, save time
CN114501804APending Publication Date: 2022-05-13上海嘉捷通信息科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
上海嘉捷通信息科技有限公司
Publication Date
2022-05-13

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Abstract

The invention relates to a 5G precision circuit board back drilling hole depth control method. The method comprises the following steps: (1) forming a first drilling hole in a laminated circuit board; (2) performing hole metallization processing on each first drilling hole to change the first drilling hole into a plated-through hole, two plated-through holes in the edge of the circuit board being a board edge test hole E and a board edge test hole F respectively; (3) secondary drilling is carried out on another plated-through hole in the edge of the circuit board to form a verification hole G, and the diameter of the secondary drilling is larger than that of the plated-through hole; (4) detecting the conduction state between the verification hole G and the board edge test hole E and / or the board edge test hole F; and (5) when the conduction state is qualified, recording the depth of the secondary drilling at the moment, and performing secondary drilling on the required position of the back drilling hole D in the center of the circuit board at the same depth to obtain the back drilling hole D meeting the depth requirement. Compared with the prior art, the method has the advantages that the circuit board structure is prevented from being damaged, time is saved, and the detection accuracy is high.
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Description

technical field

[0001] The invention relates to the field of circuit board detection, in particular to a method for controlling the depth of back-drilled holes on a 5G precision circuit board. Background technique

[0002] With the opening of the 5G cycle, a series of changes in downstream industries such as base station construction, smart phone upgrades, cloud computing, and the increase in the complexity of automotive electronics have promoted the upgrading of the circuit board (PCB) industry. There are big deficiencies, for example, conventional 4G and below communication circuit boards are mainly insulated by layers or conducted through metal holes during processing.

[0003] On the other hand, 5G circuit boards need to control back-drilling or multiple pressing and back-drilling, that is, to conduct depth-controlled drilling again after all processes are completed to ensure communication quality; the actual inter-layer accuracy is tested by designing layer alignment A...

Claims

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