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Laser machining system for carrying out machining process on workpiece by means of laser beam and method for monitoring machining process on workpiece by means of laser beam

A technology of laser processing and processing procedures, which is applied in the direction of spectrometry/spectrophotometry/monochromator, laser welding equipment, metal processing equipment, etc. Problems such as expensive parameterization

Pending Publication Date: 2022-05-13
PRECITEC GMBH
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Problems solved by technology

However, the CMOS sensors used integrate the detected radiation intensity over a large wavelength range, so that the stateability with respect to the process sequence is limited and thus also the process sequence cannot be adjusted.
To this end also arises the expensive parameterization of these systems

Method used

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  • Laser machining system for carrying out machining process on workpiece by means of laser beam and method for monitoring machining process on workpiece by means of laser beam
  • Laser machining system for carrying out machining process on workpiece by means of laser beam and method for monitoring machining process on workpiece by means of laser beam
  • Laser machining system for carrying out machining process on workpiece by means of laser beam and method for monitoring machining process on workpiece by means of laser beam

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Embodiment Construction

[0053] In the following text, the same reference numerals are used for identical or identically acting elements, unless stated otherwise.

[0054] Figure 1A A schematic diagram showing a hyperspectral sensor according to an embodiment of the disclosure. Figure 1B A schematic diagram showing a hyperspectral image that has been detected by a hyperspectral sensor according to an embodiment of the present disclosure. exist Figure 1A The hyperspectral sensor shown in can be combined with other embodiments of the present disclosure.

[0055] The hyperspectral sensor 100 has a plurality of pixels 1001 arranged along a first direction (x direction or column direction) and a second direction (y direction or row direction) perpendicular to the first direction. These two directions correspond to the two spatial dimensions of the hyperspectral image detected by the hyperspectral sensor 100 . All pixels 1001 of the hyperspectral sensor are able to detect or detect radiation in a certa...

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Abstract

A laser machining system for carrying out a machining process on a workpiece by means of a laser beam, comprising: a laser machining head for impinging the laser beam into a machining region on the workpiece; and a sensor unit for monitoring the machining process by means of at least one hyperspectral sensor, the sensor unit being configured to detect a hyperspectral image having N * M pixels from a region of the workpiece, the hyperspectral image having two spatial dimensions x and y and a spectral dimension lambda, n represents the number of pixels in the first spatial dimension x, M represents the number of pixels in the second spatial dimension y, and L represents the number of spectral bands in the spectral dimension lambda of the hyperspectral image, where M, N and L are all natural numbers. The invention further relates to a method for monitoring a machining process on a workpiece by means of a laser beam.

Description

technical field [0001] The present disclosure relates to a laser processing system for carrying out a machining process with a laser beam on a workpiece, in particular a metal workpiece, and a method for monitoring a machining process with a laser beam on a workpiece, in particular a metal workpiece. The disclosure relates in particular to a laser processing system with a sensor unit arranged to detect a hyperspectral image of a region of a workpiece and a method, in which method the hyperspectral image of the region of the workpiece is detected. Background technique [0002] In laser processing systems for processing workpieces with the aid of a laser beam, a laser beam emerging from a laser source or the end of a laser conductor fiber is focused or converged onto the workpiece to be processed by means of beam guiding and focusing optics. The processing can include, for example, laser cutting, laser brazing or laser welding. The laser processing system can comprise a laser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/03B23K26/36B23K26/21B23K31/12G06V10/774G06V10/82G06N3/04G06N3/08
CPCB23K26/032B23K26/36B23K26/21B23K31/12G06N3/04G06N3/08G06F18/214B23K31/125G01J3/36G01J3/2803G01J2003/2806G01J2003/2813G01J3/2823G01J2003/2826G06V2201/06G06V10/82G06V20/194G06V20/52G06V10/143G06V10/147G06T7/0004G06T2207/20081G06T2207/20084G06T2207/30164
Inventor J·施瓦茨
Owner PRECITEC GMBH
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