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Semiconductor element and preparation method thereof

A technology for semiconductors and components, applied in the field of semiconductor components and their preparation, can solve the problems of increased quantity and complexity, and achieve the effects of reducing manufacturing complexity, improving yield/efficiency, and avoiding corrosion

Pending Publication Date: 2022-05-17
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the process of shrinking dimensions, different problems are added, and such problems continue to increase in number and complexity
Therefore, there are still ongoing challenges in achieving improved quality, yield, performance and reliability, and reduced complexity

Method used

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  • Semiconductor element and preparation method thereof
  • Semiconductor element and preparation method thereof
  • Semiconductor element and preparation method thereof

Examples

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Embodiment Construction

[0058] Specific examples of components and configurations are described below to simplify embodiments of the present disclosure. Of course, these examples are for illustration only, and are not intended to limit the scope of the present disclosure. For example, where a first component is formed over a second component, it may include embodiments where the first and second components are in direct contact, or may include an additional component formed between the first and second components, An embodiment such that the first and second parts do not come into direct contact. Additionally, embodiments of the present disclosure may repeat reference numerals and / or letters in many instances. These repetitions are for the purpose of simplicity and clarity and, unless otherwise indicated in the context, do not in themselves imply a specific relationship between the various embodiments and / or configurations discussed.

[0059]Additionally, for ease of description, spaces such as "be...

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Abstract

The invention provides a semiconductor element and a preparation method thereof. The semiconductor device includes: a substrate; a plurality of conductive layers on the substrate; the carbon hard mask layer is positioned on the conductive layer; the isolating layer comprises a lower part and an upper part; and a conductive via disposed along the upper portion of the isolation layer and the carbon hard mask layer and located on one of an adjacent pair of conductive layers. The lower portion is disposed along the carbon mask layer and located between the adjacent pair of conductive layers, and the upper portion is on the lower portion and on the carbon mask layer.

Description

technical field [0001] This application claims priority and the benefit of U.S. Formal Application No. 17 / 099,215, filed November 16, 2020, the contents of which are hereby incorporated by reference in their entirety. [0002] The present disclosure relates to a semiconductor element and a manufacturing method of the semiconductor element. In particular, it relates to a semiconductor element with a carbon hard mask and a method for manufacturing the semiconductor element with the carbon hard mask. Background technique [0003] Semiconductor components are used in different electronic applications, such as personal computers, mobile phones, digital cameras, or other electronic devices. The size of semiconductor devices is gradually reduced to meet the increasing demand for computing power. However, during the process of shrinking dimensions, different problems are added, and such problems continue to increase in number and complexity. Therefore, challenges remain in achiev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L21/768
CPCH01L21/7681H01L21/76879H01L23/481H01L23/5226H01L21/76885H01L21/32139H01L21/76834H01L23/53295H01L21/02274H01L21/02115H01L21/0212H01L21/02271H01L21/31122H01L21/02112H01L21/0234H01L21/02348H01L21/31116H01L21/76831H01L21/76877
Inventor 何家铭
Owner NAN YA TECH