Black phosphorus-two-dimensional material compound and manufacturing method thereof, method for manufacturing black phosphorus piece and electronic device

A technology of two-dimensional materials and composites, applied in the direction of phosphorus compounds, phosphorus preparation, nitrogen compounds, etc., can solve problems such as difficult application of 2DBP

Pending Publication Date: 2022-05-20
SAMSUNG ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

2D BP can be prepared by mechanical or chemical exfoliation process on bulk BP, but it is difficult to apply this method to prepare 2DBP with large area

Method used

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  • Black phosphorus-two-dimensional material compound and manufacturing method thereof, method for manufacturing black phosphorus piece and electronic device
  • Black phosphorus-two-dimensional material compound and manufacturing method thereof, method for manufacturing black phosphorus piece and electronic device
  • Black phosphorus-two-dimensional material compound and manufacturing method thereof, method for manufacturing black phosphorus piece and electronic device

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Embodiment Construction

[0058] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of", when preceding or following a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

[0059] Hereinafter, example embodiments will be described with reference to the accompanying drawings. In the drawings, like reference numerals refer to like elements, and the dimensions of elements may be exaggerated for clarity of illustration. Th...

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Abstract

The invention provides a black phosphorus-two-dimensional material compound and a manufacturing method thereof, a method for manufacturing a black phosphorus sheet and an electronic device. The black phosphorus-two-dimensional material composite includes: first and second two-dimensional material layers each having a two-dimensional crystal structure and bonded to each other by Van der Waals' force; and a black phosphorus sheet between the first and second two-dimensional material layers and having a two-dimensional crystal structure in which a plurality of phosphorus atoms are covalently bonded.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from Korean Patent Application No. 10-2020-0154545 filed with the Korean Intellectual Property Office on November 18, 2020, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present disclosure relates to black phosphorus-two-dimensional material composites and methods of making the black phosphorus-two-dimensional material composites. Background technique [0004] Black phosphorus (BP) is a material having a layered structure, and each layer of the layered structure has a two-dimensional 2D crystal structure in which phosphorus (P) atoms are planarly bonded. BP has semiconducting properties and a band gap energy of about 0.3 eV to about 1.5 eV depending on its thickness. Furthermore, BP has about 1000cm 2 / Vs high charge mobility and about 10 4 - about 10 5 high on / off current ratio, and thus are applied to elec...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L29/20H01L29/24H01L29/267H01L29/778H01L21/02
CPCH01L29/24H01L29/267H01L21/02521H01L21/02664H01L29/7787H01L29/2003H01L21/0262H01L21/0259H01L21/02485H01L21/02444H01L21/02458H01L21/02499H01L21/02667C01B25/00C01B25/02C01B32/194C01B21/0648H01L21/02587H01L21/02612H01L29/26C01P2004/24C01P2002/22H01L21/02527H01L21/0254H01L21/02568H01L29/1606H01L29/7606
Inventor薛珉洙申铉石申铉振黄炫泰李昌锡尹圣仁
OwnerSAMSUNG ELECTRONICS CO LTD