This invention discloses a phase-change memory (PCM)
cell and its fabrication method. The PCM
cell, from bottom to top, includes: a first
electrode, a PCM unit, and a second
electrode. The PCM unit is a vertically arranged cylindrical structure, which includes, from the inside out, a select device layer, a
barrier layer, and a PCM material layer connected sequentially. Multiple first electrodes are present and connected to the PCM material
layers. The select device layer is connected to the second
electrode and includes a vertically arranged two-dimensional
crystal diode layer. This invention achieves storage by forming a structure where multiple phase-change resistors share a single select device. The use of two-dimensional
crystal diodes to form the select device effectively reduces device
power consumption and ensures compatibility with standard
CMOS process lines, thereby reducing production costs.