Grinding and polishing complete equipment and grinding and polishing method
An equipment and complete set of technology, applied in the directions of grinding devices, grinding machine tools, grinding tools, etc., can solve the problems of low production efficiency and long processing time, and achieve the effect of reducing polishing time and grinding and polishing time.
Active Publication Date: 2022-05-24
SHENZHEN UNIV
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Problems solved by technology
However, the processing time of the above-mentioned processes is long and the production efficiency is low.
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[0072] The following are the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can be made, and these improvements and modifications are also regarded as the present invention. The scope of protection applied for.
[0073] Before introducing the technical solution of the present application, the technical problems in the related art are introduced in detail.
[0074] At present, in the field of semiconductor technology, silicon carbide (SiC), a third-generation semiconductor material, is usually used as a substrate to prepare wafers. Compared with traditional silicon (Si) materials, silicon carbide has high pressure resistance, high temperature resistance, high frequency and high efficiency. It can be used as key core materials and electronic components to support industries such as new energy vehicles, high-speed ...
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Abstract
The invention provides grinding and polishing complete equipment and a grinding and polishing method. The grinding and polishing complete equipment comprises a semi-fine grinding disc, a fine grinding disc and a polishing disc. The semi-fine grinding disc is used for carrying out semi-fine grinding treatment on the wafer to be subjected to semi-fine grinding so as to remove the surface waviness of the wafer to be subjected to semi-fine grinding, and the surface roughness Ra of the wafer subjected to semi-fine grinding meets the following conditions: 100 nmlt; performing Rat; and the wavelength is 300 nm. The fine grinding disc is used for performing fine grinding treatment on the wafer subjected to semi-fine grinding so as to reduce the surface roughness of the wafer subjected to semi-fine grinding, and the surface roughness Ra of the wafer subjected to fine grinding meets the following conditions: Rat; 10 nm. The polishing disc is used for polishing the accurately ground wafer so as to reduce the surface roughness of the accurately ground wafer, and the surface roughness Ra of the polished wafer meets the following conditions: Ralt; 1 nm. According to the grinding and polishing complete equipment, a semi-accurate grinding process, an accurate grinding process and a polishing process are matched, the wafer surface roughness is gradually reduced, the machining difficulty is reduced, the machining time is shortened, and the production efficiency is improved.
Description
technical field [0001] The application belongs to the technical field of wafer manufacturing, and specifically relates to a complete set of grinding and polishing equipment and a grinding and polishing method. Background technique [0002] Currently, in the field of wafer fabrication technology, the surface roughness Ra of the wafer is usually required to reach sub-nanometer level. Therefore, it is usually necessary to grind and polish the wafer to reduce the roughness of the wafer surface. However, at present, the above-mentioned process has a long processing time and low production efficiency. SUMMARY OF THE INVENTION [0003] In view of this, a first aspect of the present application provides a complete set of equipment for grinding and polishing, including: [0004] The semi-finishing disc is used to perform semi-finishing processing on the wafer to be semi-finished, so as to remove the surface waviness of the wafer to be semi-finished, and at the same time, the surf...
Claims
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IPC IPC(8): B24B1/00B24B37/00B24B37/11B24B37/34
CPCB24B1/00B24B37/00B24B37/11B24B37/34
Inventor 王序进赵泽佳郭登极刘峥熊晶
Owner SHENZHEN UNIV