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Wafer structure

A wafer and chip technology, applied in printing, inking devices, etc., can solve the problems of wasting blank area, waste, restrictions, etc.

Pending Publication Date: 2022-05-27
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the printable range (printing swath) of an inkjet chip on a wafer structure below 6 inches exceeds 1 inch (inch) or the page width printable range (printing swath) A4 size (8.3 inches (inch)) to Under the requirements of higher high-resolution and higher-speed printing, the number of required inkjet chips will be quite limited when compared to the wafer structure with a limited area below 6 inches. Manufacturing demanded inkjet chips on a wafer structure with a limited area below 6 inches will waste the remaining blank area, and these blank areas will occupy more than 20% of the entire wafer area, which is quite wasteful. cost can not be effectively reduced

Method used

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Embodiment Construction

[0062] Embodiments embodying the features and advantages of the present case will be described in detail in the description of the latter paragraph. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are essentially used for illustration rather than limiting this case.

[0063] see figure 1 and figure 2 As shown, the present application provides a wafer structure 2 including a chip substrate 20 and a plurality of inkjet chips 21 . The chip substrate 20 is a silicon substrate, which is manufactured by a semiconductor process of at least 12 inches or more. In one embodiment, the chip substrate 20 may be fabricated using a semiconductor process of a 12-inch (inch) wafer; or, in another embodiment, the chip substrate 20 may be fabricated using a 16-inch (inch) wafer. It is produced by semiconductor process, but not limited to this.

[0064] The ...

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Abstract

A wafer structure comprises: a chip substrate which is a silicon substrate and is manufactured by a semiconductor process of a wafer of at least 12 inches; the ink jet chip is directly generated on a chip substrate through a semiconductor manufacturing process and is cut into ink jet chips to be applied to ink jet printing, the ink jet chip comprises a plurality of ink droplet generators, the ink droplet generators are generated on the chip substrate through the semiconductor manufacturing process, each ink droplet generator is provided with a spraying hole, the diameter of each spraying hole ranges from 0.5 micrometer to 10 micrometers, and the diameter of each spraying hole ranges from 0.5 micrometer to 10 micrometers. The volume of ink-jet liquid drops ejected from the spray holes is between 1-3 picoliters; wherein the ink jet chip is configured into a plurality of longitudinal axis array groups extending in the longitudinal direction and keeping a distance between adjacent ink droplet generators, and a plurality of horizontal axis row groups extending in the horizontal direction and keeping a central step distance between adjacent ink droplet generators, and the central step distance is at least less than 1 / 600 inch.

Description

【Technical field】 [0001] This case relates to a wafer structure, especially a wafer structure for producing inkjet chips suitable for inkjet printing by semiconductor process. 【Background technique】 [0002] In addition to laser printers, inkjet printers are another widely used type of printers currently on the market. They have the advantages of low price, easy operation and low noise, and can print on various types of paper such as paper and photo paper. Inkjet media. The printing quality of an inkjet printer mainly depends on factors such as the design of the ink cartridge. In particular, the design of the inkjet chip to release ink droplets to the inkjet medium is an important consideration in the design of the ink cartridge. [0003] In the highly competitive inkjet printing market, the price of inkjet printers has dropped rapidly, so the ink cartridges are used with ink cartridges. The manufacturing cost of the ink chip and the design cost of higher resolution and hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14
CPCB41J2/14B41J2/04541B41J2/0458B41J2/1404B41J2/14072B41J2/14129B41J2/1601B41J2/1603B41J2/1631B41J2/1632B41J2/1635B41J2/1642B41J2/1646B41J2002/14459B41J2/145B41J2/14145B41J2202/11
Inventor 莫皓然张英伦戴贤忠韩永隆黄启峰李伟铭
Owner MICROJET TECH
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