Three-dimensional heat transfer device

Abstract

The invention relates to a three-dimensional heat transfer device. The three-dimensional heat transfer device comprises a first heat conduction shell, a second heat conduction shell, a plurality of supporting structures, at least one extension conduction structure, at least one capillary structure and at least one heat pipe, the second heat conduction shell is provided with at least one through hole, and the second heat conduction shell is arranged on the first heat conduction shell, so that the first heat conduction shell and the second heat conduction shell jointly form a liquid-tight cavity. One end of each supporting structure is connected to the first heat conduction shell. The other ends of the supporting structures are connected to the second heat conduction shell. The extended conductive structure is connected to at least a portion of the support structures. The capillary structure is stacked on the first heat conduction shell, the parts of the supporting structures and the at least one extension conduction structure. The heat pipe passes through the through hole.

Description

technical field [0001] The invention relates to a heat transfer device, in particular to a three-dimensional heat transfer device. Background technique [0002] The technical principle of the vapor chamber is similar to the heat pipe, but there is a difference in the way of conduction. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum chamber vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, the vapor chamber mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used for filling the working fluid. Capillary tissue is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity where heat is dissipated is called the condensation zone. The working fluid absorbs heat in the evaporation zone and evaporates and rapidly expands to the entire cavity. The heat is releas...

AI Technical Summary

Problems solved by technology

[0003] However, the current vapor chambers and heat pipes operate independently, resulting in individual heat transfer in a plane or a straight line rather than an integral three-dimensional heat transfer in terms of individual vapor chambers or individual heat pipes. In other words, The heat dissipation effect has not been fully utilized

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