Cutting layout design method suitable for introducing customized chip and chip prepared by cutting layout design method

A layout design and chip technology, applied in manufacturing computing systems, computer-aided design, CAD customization/personalization, etc., can solve the problems of cutting yield and low efficiency, to ensure reliability, reduce cutting times, and reduce secondary The effect of cutting risk
CN114548019AActive Publication Date: 2022-05-27成都复锦功率半导体技术发展有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
成都复锦功率半导体技术发展有限公司
Publication Date
2022-05-27

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Abstract

The invention discloses a cutting layout design method suitable for introducing a customized chip and a chip prepared through the cutting layout design method, and belongs to the technical field of semiconductors. Chip classification processing is carried out according to chip appearance parameters, and conventional chip data and customized chip data are obtained; performing typesetting calculation according to the conventional chip data and the upper limit value of the operable area of the wafer, and outputting all layout design sketches with penetrating scribing grooves; and performing secondary design on the reserved position in the layout design sketch according to the customized chip data, and outputting a secondary layout design sketch. According to the method, a conventional chip is firstly subjected to typesetting design to obtain a layout design sketch penetrating through a scribing groove, so that the secondary cutting risk is greatly reduced; under the condition that the area is reserved, the scribing groove design of the customized chip is planned, the overall change of the layout design sketch is controlled within the minimum range, and the layout design sketch compatible with the customized chip is obtained on the basis that conventional chip layout is not affected, so that the layout cutting yield and efficiency are guaranteed.
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Description

technical field

[0001] The invention relates to the technical field of semiconductors, in particular to a cutting layout design method suitable for introducing custom chips and a chip prepared therefrom. Background technique

[0002] The layout design of integrated circuits plays a crucial role in the design process of silicon-based semiconductors, and is an important intermediate link in the circuit design and the driving process. As the development of silicon-based power semiconductors in China is becoming more and more mature, the requirements for high-yield and high-efficiency layout drawing have gradually emerged, and the layout design of silicon-based power semiconductors with stable and reliable, strong process affinity, easy cutting and picking, and high area utilization will be quickly obtained. Help further save chip costs, effectively shorten the chip development cycle, and help products occupy the civilian market faster.

[0003] The chip form that can directly ...

Claims

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