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Method for producing an optoelectronic component

An optoelectronic device and device technology, which is applied in the direction of electrical solid devices, electrical components, semiconductor devices, etc., can solve the problems of difficult implementation of photolithography methods and the opacity of visible light in the photoluminescent layer.

Pending Publication Date: 2022-05-27
ALEDIA
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  • Application Information

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Problems solved by technology

[0006] The disadvantage of this approach is that the photoluminescent layer may be partially opaque to visible light, making photolithographic methods for detecting alignment marks potentially difficult to implement

Method used

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  • Method for producing an optoelectronic component
  • Method for producing an optoelectronic component
  • Method for producing an optoelectronic component

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Embodiment Construction

[0076] Similar features are denoted by like reference numerals in the various figures. In particular, structural and / or functional features that are common to the various embodiments may have the same reference numerals and may have the same structural, dimensional and material properties. For the sake of clarity, only steps and elements useful for understanding the embodiments described herein have been illustrated and described in detail.

[0077] In the following description, when referring to terms that define absolute positions, such as the terms "front", "rear", "top", "bottom", "left", "right", etc., or referring to terms that define relative positions When referring to the terms "upper", "lower", "upper", "lower", etc., or referring to a term that defines a direction, such as the terms "horizontal", "vertical", etc., it refers to the orientation or indication of the figure Optoelectronics in the position of normal use. Unless stated otherwise, the expressions "about"...

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Abstract

The present disclosure relates to a method of manufacturing an optoelectronic device (5) comprising an assembly of light emitting diodes (LEDs) having first and second assemblies, and first blocks (32) made of a first photoluminescent material, each first block covering one of the first assemblies. The method includes forming a layer covering the first component and the second component, defining a first opening in the layer to expose the first component, filling the first opening with a first material, and performing chemical mechanical polishing to define a first block.

Description

[0001] This patent application claims priority from French patent application FR19 / 11133, which is hereby incorporated by reference. technical field [0002] The present invention generally relates to optoelectronic devices comprising nanoscale or microscale semiconductor elements, in particular microwires or nanowires, or structures having the shape of pyramids to form light emitting diodes and photoluminescent blocks covering the light emitting diodes. Background technique [0003] The term "optoelectronic device" is used to denote a device capable of converting an electrical signal into electromagnetic radiation or vice versa, especially a device dedicated to detecting, measuring or emitting electromagnetic radiation. Electronic devices with three-dimensional semiconductor elements may include light-emitting diodes covered by photoluminescent blocks. [0004] A method of fabricating such an optoelectronic device includes forming light emitting diodes on a substrate and fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L27/15
CPCH01L33/504H01L27/156H01L2933/0041H01L25/0753H01L21/30625H01L33/005H01L33/62H01L2933/00
Inventor 马克西姆·博伊斯塔德菲力浦·吉贝尔弗雷德里克·马耶尔埃里克·普尔基耶希尔维亚·斯卡林盖拉克莱曼斯·塔莱
Owner ALEDIA
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