Auxiliary equipment for semiconductor production and processing
An auxiliary equipment and semiconductor technology, applied in metal processing equipment, welding equipment, metal processing and other directions, can solve the problems of unfavorable cleaning mechanism maintenance, inconvenient circuit rapid welding, etc., to achieve the effect of welding
Pending Publication Date: 2022-05-31
江苏晶曌半导体有限公司
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Problems solved by technology
[0003] However, the current larger semiconductor circuit board needs to turn over the circuit board when welding the circuit. In the assembly line, the worker needs to turn over the circuit board after welding the other side of the semiconductor circuit board. For the equipment that flips the semiconductor circuit board before the circuit is welded, it is inconvenient to quickly weld the circuit, and the circuit board usually needs to be cleaned before the circuit is welded. The components used for cleaning are generally installed on the conveyor belt. When the dust cleaning mechanism is damaged and needs to be repaired, it is necessary to tilt the body to the conveyor belt for a long time, and it is difficult to turn the dust cleaning mechanism to the outside of the conveyor belt, which is not conducive to the maintenance of the dust cleaning mechanism
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[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0030] like Figure 1-Figure 7 As shown, a kind of auxiliary equipment for semiconductor production and processing according to the present invention includes a first support 1, and a turning mechanism 3 for turning over a semiconductor circuit board is installed on the first support 1, and a turning mechanism 3 is installed on the turning mechanism 3. There is an adjustment mechanism 5, and the turning mechanism 3 is equipped with a drive mechanism 6 that facilitates the rotation of the adjustment mechanism 5. The first bracket 1 is equipped with a delivery mechanism 2 for transporting semiconductor circuit boards. At the bottom of the mechanism 3, the first bracket 1 is equipped with a dust suction mechanism 4 at the top of the conveying mechani...
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The invention relates to the technical field of semiconductor processing assistance, in particular to auxiliary equipment for semiconductor production and processing, which comprises a first bracket, a turnover mechanism is mounted on the first bracket, an adjusting mechanism is mounted on the turnover mechanism, and a driving mechanism facilitating rotation of the adjusting mechanism is mounted on the turnover mechanism. A conveying mechanism for conveying a semiconductor circuit board is mounted on the first bracket, and a dust collection mechanism located at the top of the conveying mechanism is mounted on the first bracket; the length of the conveyed semiconductor circuit board is guaranteed to be larger than the width of the conveying mechanism, after circuit welding of one face of the semiconductor circuit board is completed, the semiconductor circuit board is placed on the conveying mechanism, the conveying mechanism is matched with the turnover mechanism to feed the multiple semiconductor circuit boards, and after the turnover mechanism rotates by 180 degrees, the turnover mechanism rotates. The first fed circuit board is overturned, after the first circuit board makes contact with the conveying mechanism, the overturned circuit board is conveyed and discharged through the conveying mechanism, and welding of the circuit board is facilitated.
Description
technical field [0001] The invention relates to the field of semiconductor processing auxiliary technology, in particular to auxiliary equipment for semiconductor production and processing. Background technique [0002] Semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature; semiconductors are widely used in radios, televisions, and temperature measurement, such as the core units of computers, mobile phones, or digital recorders. Closely related, there are processing procedures such as degumming, printed circuit, and welding when processing semiconductor circuit boards. [0003] However, the current larger semiconductor circuit board needs to turn over the circuit board when welding the circuit. In the assembly line, the worker needs to turn over the circuit board after welding the other side of the semiconductor circuit board. For the equipment that flips the semiconductor circuit board before the circuit i...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B23K3/08
CPCB23K3/08B23K2101/42
Inventor 白俊春程斌平加峰
Owner 江苏晶曌半导体有限公司