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Embedded temperature measurement sensing structure and temperature measurement method

A temperature measurement sensor and sensing technology, applied in thermometers, heat measurement, measuring devices, etc., can solve the problems of inaccurate measurement, poor heat transfer efficiency, inconvenient disassembly and replacement of temperature measurement and sensing equipment, and achieve improvement Sealing and reliability, saving time and cost, good heat conduction effect

Pending Publication Date: 2022-05-31
SHANGHAI MICROPOWERS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The heat transfer efficiency between the temperature sensor in the built-in temperature sensor device and the sealed structure medium is poor, and the measurement is not accurate;
[0005] 2. It is inconvenient to disassemble and replace the built-in temperature sensing equipment

Method used

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  • Embedded temperature measurement sensing structure and temperature measurement method
  • Embedded temperature measurement sensing structure and temperature measurement method
  • Embedded temperature measurement sensing structure and temperature measurement method

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Embodiment Construction

[0048] In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the specific embodiments of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative efforts, and obtain other implementations.

[0049] For the sake of brevity of the drawings, only the parts relevant to the invention are schematically shown in each drawing, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. As used herein, "one" not only means "only one", but also "more ...

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Abstract

The invention discloses an embedded temperature measurement sensing structure and a temperature measurement method. The embedded temperature measurement sensing structure comprises a supporting assembly and a temperature measurement assembly. The supporting assembly is fixed at the edge of an opening of a structure to be subjected to temperature measurement and is communicated with the interior of the structure to be subjected to temperature measurement, the temperature measurement assembly penetrates through the interior of the supporting assembly, and one end of the temperature measurement assembly extends into the structure to be subjected to temperature measurement to measure the temperature of a medium in the structure to be subjected to temperature measurement. The temperature measurement assembly comprises a heat conduction sleeve and a temperature measurement sensor arranged in the heat conduction sleeve, one end, in contact with a medium in the structure to be subjected to temperature measurement, of the heat conduction sleeve is in contact with the temperature measurement sensor, and heat of the medium in the structure to be subjected to temperature measurement is transferred to the temperature measurement sensor for temperature measurement by filling copper powder in the heat conduction sleeve. According to the embedded temperature measurement sensing structure, the temperature measurement assembly directly extends into the structure to be subjected to temperature measurement, and one end, which is in contact with a medium in the structure to be subjected to temperature measurement, of the heat conduction sleeve in the temperature measurement assembly is in contact with the temperature measurement sensor, so that the embedded temperature measurement sensing structure provided by the invention has higher measurement precision.

Description

technical field [0001] The invention relates to the technical field of temperature sensing structures, in particular to an embedded temperature sensing structure and a temperature measuring method. Background technique [0002] In recent years, with the improvement of the level of science and technology, the requirements for measurement and sensing equipment are also increasing. The accuracy of the measurement sensing equipment directly affects the accuracy of the test data. In addition to the poor accuracy of the equipment itself, traditional measurement and sensing equipment also has large measurement errors. In the field of temperature sensing, common contact temperature sensing devices are mainly divided into bare chip type and package type in terms of structure. The bare chip type sensor measures by pasting the sensor in the measurement area, and the package type sensor structure uses a specific adapter. The structure is mechanically fixed. However, due to the specia...

Claims

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Application Information

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IPC IPC(8): G01K1/08G01K1/14G01K1/18
CPCG01K1/08G01K1/14G01K1/18
Inventor 程子云王健崔腾飞李强何慧翔李子木吴昊程亦薇张智伟
Owner SHANGHAI MICROPOWERS