LED support, manufacturing method of LED support and LED light-emitting device

Abstract

The invention is suitable for the technical field of LED production, and provides an LED support, a manufacturing method of the LED support and an LED light-emitting device. The LED support comprises a metal substrate and a packaging body, at least part of the metal substrate is embedded in the packaging body, the metal substrate comprises a plate body and a footing arranged on the periphery of the plate body, the back face of the footing is provided with an exposed area and an insertion strip area and is provided with a notch, the notch is at least formed in the insertion strip area, and the packaging body comprises a main body part and an insertion strip part. The main body part is formed on the front surface of the metal substrate and covers the edge of the plate body; the insertion strip part is formed in the insertion strip area and is integrally connected to the main body part; the footing is exposed out of the packaging body corresponding to the exposed area, and the footing is provided with an insertion strip part corresponding to the insertion strip area. According to the LED support, the manufacturing method of the LED support and the LED light-emitting device, the air tightness of the support is improved, the using effect is good, the stress transmitted into plastic in the cutting process is reduced, the cracking risk is reduced, the production yield is improved, and cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of LED production, and in particular relates to an LED bracket, a manufacturing method of the LED bracket and an LED lighting device. Background technique [0002] The current LED light-emitting device includes an LED bracket, and the bracket includes a package body and a metal substrate combined with the package body. The structure of the cutting-type LED bracket used is that there are plastics on the four sides of the side of the bracket (that is, one of the materials forming the package body) ) package, the metal material of the metal substrate leaking from the four sides is covered by plastic. This structure makes the use of lamp bead plastic high and increases the production cost, and the heat dissipation point is limited to the bottom pad, and the heat dissipation path is limited. In addition, when the bracket is cut, at least a part of the metal substrate will be cut by the cutter at the same time as ...

AI Technical Summary

Problems solved by technology

[0002] The current LED light-emitting device includes an LED bracket, and the bracket includes a package body and a metal substrate combined with the package body. The structure of the cutting-type LED bracket used is that there are plastics on the four sides of the side of the bracket (that is, one of the materials forming the package body) ) package, the metal material of the metal substrate leaking from the four sides is covered by plastic, this structure makes the use of lamp bead plastic high and increases the production cost, and the heat dissipation point is limited to the bottom pad, and the heat dissipation path is limited

In addition, when the bracket is cut, at least a part of the metal substrate will be cut by the cutter at the same time as the package body, so that the part of the metal substrate exposed on the cut surface is coplanar with the outer side of the package body. Because the material properties of the metal substrate and the package body are different, the The force feedback of the cutting tool is inconsistent, and the stress generated by the metal substrate by the tool is transmitted to the plastic during cutting, which may cause the bracket to break or affect the airtightness of the combination of the metal substrate and the package, and the use effect is not good

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