Flexible connection structure of upper cover plate and lower cover plate of vapor chamber

Abstract

The invention relates to the technical field of heat dissipation. The flexible connecting structure of the upper cover plate and the lower cover plate of the vapor chamber comprises a vapor chamber body, the body comprises the flexible upper cover plate and the flexible lower cover plate, the edges of the flexible upper cover plate and the flexible lower cover plate are connected with each other, the flexible upper cover plate and the flexible lower cover plate are supported through a supporting mechanism, and a working cavity is formed between the flexible upper cover plate and the flexible lower cover plate; the supporting mechanism comprises a plurality of flexible and hollow supporting bosses arranged on the inner surface of the flexible upper cover plate and the inner surface of the flexible lower cover plate, the supporting bosses are distributed on the flexible upper cover plate and the flexible lower cover plate in a matrix shape, and liquid supporting evaporation working media are arranged in inner cavities of the supporting bosses. After the supporting evaporation working medium in the supporting boss is heated and evaporated, the supporting boss can be expanded to form shape molding; and the working cavity is supported through the supporting boss. The working cavity of the vapor chamber can be effectively supported, normal heat dissipation of the vapor chamber is guaranteed, and meanwhile the vapor chamber has excellent flexibility and folding performance.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a flexible connection structure of upper and lower cover plates of a vapor chamber. Background technique [0002] A vapor chamber is a vacuum chamber with microstructured inner walls, usually made of copper. When the heat is transferred from the heat source to the evaporation area, the cooling liquid in the cavity starts to vaporize after being heated in a low-vacuum environment. At this time, heat energy is absorbed and the volume expands rapidly, and the gas-phase cooling medium quickly fills the entire body. In the cavity, condensation will occur when the gas-phase working fluid comes into contact with a relatively cold area. The heat accumulated during evaporation is released through the condensation phenomenon, and the condensed coolant will return to the evaporation heat source through the capillary channel of the microstructure, and this operation will be repeate...

AI Technical Summary

Problems solved by technology

[0004] 1. The thermal conduction rate of the flexible vapor chamber, the heat source and the heat dissipation backplane: At present, the traditional vapor chamber is made of copper-based material, which has reliable heat conduction performance and can stably and quickly realize the connection between the vapor chamber and the heat source. , Heat conduction between the vapor chamber and the heat dissipation backplane (usually the backplane of the equipment shell)

If the traditional single-side combination method is used for heat conduction, due to the limited heat conduction area, the overall heat dissipation efficiency of the vapor chamber will be reduced

[0005] 2. Since the flexible vapor chamber needs to be made of flexible materials, in order to meet the needs of folding, it is not suitable to use a rigid support structure between the upper cover and the lower cover, so it is generally selected to be sandwiched between the upper and lower cover. The flexible corrugated plate with holes in between, or the elastic convex column formed on the upper / lower cover plate, etc. are used as supporting structures to ensure sufficient refrigerant evaporation space between the upper and lower cover plates; but these types of supporting structures In the application process, its support mainly comes from the elasticity of the material itself; in the process of repeated folding and use of the equipment, as the elastic fatigue of the material intensifies, its support will decrease significantly, which will lead to the collapse of the cavity of the vapor chamber. Affect the circulation of the working fluid in the vapor chamber, and ultimately affect the heat dissipation efficiency

The flexible foldable vapor chamber uses thermally conductive silica gel sheets as the upper and lower cover plates, which cannot be sealed by the welding process of traditional copper-based materials; therefore, how to ensure the stable combination of the upper and lower cover plates of the flexible foldable vapor chamber, Avoiding leakage of working fluid is also an extremely critical issue

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