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Multi-pressure-head flexible composite leveling mechanism for thin plate and method for leveling memory thin plate

A thin plate and pressure head technology, applied in the field of multi-pressure head flexible composite leveling mechanism and using it to level memory thin plates

Pending Publication Date: 2022-06-03
JIANGXI NERIN EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still many problems in the current leveling machine and leveling method.

Method used

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  • Multi-pressure-head flexible composite leveling mechanism for thin plate and method for leveling memory thin plate
  • Multi-pressure-head flexible composite leveling mechanism for thin plate and method for leveling memory thin plate
  • Multi-pressure-head flexible composite leveling mechanism for thin plate and method for leveling memory thin plate

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Embodiment Construction

[0017] The solution of the present invention will be explained below in conjunction with the embodiments. Those skilled in the art will understand that the following examples are only used to illustrate the present invention, and should not be construed as limiting the scope of the present invention. If no specific technique or condition is indicated in the examples, the technique or condition described in the literature in the field or the product specification is used. The reagents or instruments used without the manufacturer's indication are conventional products that can be obtained from the market.

[0018] The present invention will be described below with reference to specific embodiments. It should be noted that these embodiments are merely illustrative and do not limit the present invention in any way.

[0019] In one aspect of the present invention, the present invention provides a multi-head flexible composite leveling mechanism for thin plates. According to an em...

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Abstract

The invention provides a multi-pressure-head flexible composite leveling mechanism for a thin plate and a method for leveling a memory thin plate. The multi-pressure-head flexible composite leveling mechanism comprises a base; the first rack and the second rack are arranged on the two opposite sides of the upper surface of the base. The movable pressing block is arranged on the first rack; the at least one driving device is arranged on the first rack and is used for driving the movable pressing block to move; the first group of adjustable pressure heads are arranged on the movable pressure block; the second group of adjustable pressure heads are arranged on the second rack and right correspond to the first group of adjustable pressure heads, and the distance between the first group of adjustable pressure heads and the second group of adjustable pressure heads is in a complementary state. The memory sheet flattening device can well achieve the flattening effect on a memory sheet, eliminates internal stress in the memory sheet, can completely meet the requirements of different deformation amounts at different positions of the surface of the memory sheet on the flattening reverse deformation amount, and effectively improves the flattening efficiency and flattening effect on the memory sheet. The flattening efficiency is improved; the leveling device is particularly suitable for leveling the cobalt metal cathode plate surface above an electrolytic cell.

Description

technical field [0001] The present invention relates to the technical field of thin plate leveling, in particular to a multi-press flexible composite leveling mechanism for thin plates and a method for leveling memory thin plates using the same. Background technique [0002] In non-ferrous metal smelting, the cathode is immersed in an acidic electrolyte. After the direct current is turned on, the metal starting plate will slowly adhere to the surface of the cathode, which will gradually thicken and form a metal product. In order to improve the electrolysis current efficiency, the distance between the cathode and the anode is generally very small, and at the same time, in order to prevent abnormal phenomena such as short circuit caused by the contact between the electrodes, the cathode and anode plate surfaces are required to be as flat as possible. In order to improve the flatness of the cathode of the starting plate during the electrolysis process, it is usually necessary t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D1/00B21C51/00
CPCB21D1/00B21C51/00Y02P10/20
Inventor 邓爱民彭宏道卫东东熊家志
Owner JIANGXI NERIN EQUIP
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