Integrated ultrathin water-cooling radiator

Abstract

The invention discloses an integrated ultrathin water-cooling radiator which comprises a radiator body, the radiator body comprises a middle frame, a micro water pump and a cooling fan are arranged on the middle frame, and the micro water pump is arranged on one side of the cooling fan; the middle frame is further provided with a heat absorption cavity and a heat dissipation area. The heat absorption cavity is arranged on one side of the micro water pump, and the heat dissipation area is arranged on one side of the heat dissipation fan. The middle frame is further provided with a flow channel used for containing circulating water. The flow channel comprises a first flow channel body arranged on the side face of the cooling fan and a second flow channel body located at the bottom of the cooling area. The radiator provided by the invention is small in size, high in integration level and large in heat dissipating capacity, can be conveniently arranged in the mobile electronic equipment, and is of an integrated structural design, and connection between a water pipe and a water pump does not need to be considered, so that leakage of cooling liquid is avoided.

Description

technical field [0001] The invention relates to the technical field of water-cooling radiators, in particular to an integrated ultra-thin water-cooling radiator. Background technique [0002] With the advancement of technology, the power consumption of mobile electronic devices (such as mobile phones, tablet computers, etc.) is getting higher and higher, and the heat generation is also increasing. The heat dissipation requirements of the mobile electronic equipment are relatively limited, so the heat dissipation methods used are relatively limited. [0003] The first method: passive heat dissipation system, which absorbs heat from the heat dissipation component, and then directly transfers the heat from the heat dissipation component to the air without manual intervention; the second method: active air-cooled heat dissipation system. The heat source absorbs heat in contact with the heat source, and then the heat is directly transferred to the heat dissipation component. Fin...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned first and second methods, because air is a poor conductor of heat, lead to limited heat dissipation effect; the third method can solve the problem of limited heat dissipation effect, but adopts a split structure, which takes up a lot of space, and at the same time The connection between the water pipe and the pump is also prone to leakage, which can cause damage to the equipment

[0005] Therefore, none of the above three methods can meet the heat dissipation requirements of mobile electronic equipment.

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