Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy-modified silicone microparticles, method for producing same, thermosetting resin composition containing same, and sealing material

A technology of epoxy modification and manufacturing method, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device parts, circuits, etc., to achieve excellent dispersion, excellent mechanical properties, and excellent adhesion

Pending Publication Date: 2022-06-10
SHIN ETSU CHEM IND CO LTD +1
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the shell part of acrylic or silicone is not chemically bonded to the epoxy resin, the adhesiveness is low, and since the Tg of the acrylic is below the curing temperature of the epoxy resin, fusion aggregation may occur and cannot be dispersed evenly, there is room for improvement

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy-modified silicone microparticles, method for producing same, thermosetting resin composition containing same, and sealing material
  • Epoxy-modified silicone microparticles, method for producing same, thermosetting resin composition containing same, and sealing material
  • Epoxy-modified silicone microparticles, method for producing same, thermosetting resin composition containing same, and sealing material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

Embodiment 2～8、 comparative example 1～5

Embodiment 9～16、 comparative example 6～12

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The purpose of the present invention is to provide: silicone microparticles which do not aggregate in a thermosetting resin despite having the flexibility of silicone rubber and which have excellent adhesion to the thermosetting resin; also provided are a thermosetting resin composition and a sealing material containing the microparticles. Epoxy-modified silicone microparticles and a method for producing the same, the epoxy-modified silicone microparticles being characterized by being obtained by coating (A) silicone rubber spherical microparticles having an average particle diameter of 0.1-100 [mu] m with (B) a polyorganosilsesquioxane, the (B) polyorganosilsesquioxane having an epoxy group-containing organic group.

Description

technical field [0001] The present invention relates to epoxy-modified silicone microparticles, particularly to silicone microparticles having the softness of silicone rubber but not aggregating in thermosetting resins and having excellent adhesion to thermosetting resins, and their production method. It also relates to a thermosetting resin composition and a sealing material containing the microparticles. Background technique [0002] Conventionally, in the field of element sealing of electronic component devices such as transistors and ICs, sealing with resin has been the mainstream from the viewpoints of productivity and cost. As the resin for sealing, an epoxy resin excellent in balance of properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to embedded products is mainly used. However, since epoxy resins have disadvantages of being hard and brittle, epoxy resins themselves are modified or additives having ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/12C08L83/04C08L83/06C08G77/14C08L63/00H01L23/29
CPCC08J3/126C08G77/14C08L63/00H01L23/296C08J2383/04C08J2483/06C08L83/04C08L83/06H01L23/295C08J2363/00C09D183/06C08G77/38
Inventor 井口良范酒井美绪
Owner SHIN ETSU CHEM IND CO LTD