Stamp hole arrangement structure for PCB and corresponding PCB forming method

A forming method and technology of stamp holes, which are applied in the field of stamp holes, can solve problems such as unreasonable structure of bridge-connected stamp holes, protruding board edges of residual piles of connecting ribs, etc., and achieve better shape flatness

Pending Publication Date: 2022-06-21
CARVEN TECH WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Purpose of the invention: The purpose of this invention is to solve the problem that the existing bridge-connected stamp hole structure is unreasonable, resulting in the problem that there are connecting ribs and residual piles protruding from the edge of the board after the board is divided.

Method used

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  • Stamp hole arrangement structure for PCB and corresponding PCB forming method
  • Stamp hole arrangement structure for PCB and corresponding PCB forming method
  • Stamp hole arrangement structure for PCB and corresponding PCB forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] as attached figure 1 As shown in the figure, this embodiment is suitable for a small-sized conventional PCB, a kind of stamp hole arrangement structure for PCB, including four stamp holes 1 located in sequence near the current PCB outline, and two stamp holes located at the head and tail. 1 The center of the circle coincides with the outline 2 of the current PCB, and the two stamp holes 1 located in the middle are sunk by 0.25mm toward the inside of the PCB compared to the two stamp holes 1 located at the head and tail.

[0034] The groove-shaped PCB stamp hole is adopted, but the sinking distance in the middle will not cause the overall shape difference to be too large, which will lead to the splitting of the board. It avoids the problem of forming connecting rib residual piles after existing sub-slabs.

[0035] Four stamp holes 1 are used, the apertures of the four stamp holes 1 are all 0.8 mm, and the center-to-center distance of the adjacent stamp holes 1 is 1.1 mm...

Embodiment 2

[0045] as attached figure 2 As shown, this embodiment is suitable for special situations such as small-sized optoelectronic boards and insufficient board edge space. A stamp hole arrangement structure for PCB includes four stamp holes 1 arranged in sequence near the current PCB outline 2, located in The centers of the two stamp holes 1 at the head and tail coincide with the outline 2 of the current PCB, and the two stamp holes 1 in the middle are sunk by 0.25mm toward the PCB compared to the two stamp holes 1 at the head and tail.

[0046] The groove-shaped PCB stamp hole is adopted, but the sinking distance in the middle will not cause the overall shape difference to be too large, which will lead to the splitting of the board. It avoids the problem of forming connecting rib residual piles after existing sub-slabs.

[0047] Four stamp holes 1 are used, the diameters of the four stamp holes 1 are all 0.5mm, and the center-to-center distance of the adjacent stamp holes 1 is 0....

Embodiment 3

[0057] as attached image 3 As shown, this embodiment is suitable for a conventional PCB of general size, a stamp hole arrangement structure for PCB, including six stamp holes 1 located in sequence near the current PCB outline 2, and two stamp holes located at the head and tail. The center of the hole 1 coincides with the outline line 2 of the current PCB, and the four stamp holes 1 located in the middle are sunk by 0.25mm toward the inside of the PCB compared to the two stamp holes 1 located at the head and tail.

[0058] The groove-shaped PCB stamp hole is adopted, but the sinking distance in the middle will not cause the overall shape difference to be too large, which will lead to the splitting of the board. It avoids the problem of forming connecting rib residual piles after existing sub-slabs.

[0059] Six stamp holes 1 are used, the apertures of the six stamp holes 1 are all 0.8 mm, and the center-to-center distance of the adjacent stamp holes 1 is 1.1 mm.

[0060] A P...

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PUM

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Abstract

The invention discloses a stamp hole arrangement structure for a PCB (Printed Circuit Board), which comprises four or six stamp holes which are arranged in sequence and are positioned close to the appearance line of the current PCB, the circle centers of the two stamp holes positioned at the head part and the tail part coincide with the appearance line of the current PCB, and the two or four stamp holes positioned in the middle sink for 0.25 mm towards the interior of the PCB compared with the two stamp holes positioned at the head part and the tail part. The invention further discloses a corresponding PCB forming method after the stamp hole arrangement structure is adopted. By adopting the design scheme of the invention, an existing design method of pure linear arrangement of stamp holes is replaced, so that no connecting rib stub is formed after the stamp holes at the head and the tail are milled, and the appearance flatness of the PCB is better.

Description

technical field [0001] The invention relates to a stamp hole, in particular to a stamp hole arrangement structure for PCB and a corresponding PCB forming method. Background technique [0002] According to the project designed according to the bridging + stamp hole scheme in the original "Printed Board Design Specification", after the physical board is divided, the connecting rib stub at the position of the bridging stamp hole has the problem of protruding from the edge of the board, which affects the flatness of the printed shape. In severe cases, it will also affect the assembly of the printed board. SUMMARY OF THE INVENTION [0003] Purpose of the invention: The purpose of the present invention is to solve the problem that the existing bridging stamp hole structure is unreasonable, which leads to the problem that the connecting rib stubs protrude from the edge of the plate after the plate is divided. [0004] Technical scheme: in order to realize the above-mentioned pur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14H05K3/00
CPCH05K1/02H05K1/14H05K3/0044
Inventor 莫其森
Owner CARVEN TECH WUXI
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