Multilayer ceramic electronic component and board for mounting same
A technology for electronic components and multi-layer ceramics, applied in electrical components, multilayer capacitors, components of fixed capacitors, etc., can solve problems such as reliability reduction, delamination, space utilization, and installation freedom.
Pending Publication Date: 2022-06-24
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
However, when the overlapping area of the internal electrodes increases, the area occupied by electronic components on the substrate increases, so that there may be problems of reduced space utilization and freedom of installation.
In addition, if the number of stacked internal electrodes increases, the area where the edge portion of the sheet shape should be attached widens, which increases the bonding surface, where delamination may occur, and lifting of the edge portion may occur ( lifting) or flaring, so that there may be problems that reliability may be reduced or short-circuit defects may occur
Method used
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[0024] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. This disclosure may, however, be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein, but rather to include various modifications, equivalents, and / or alternatives to the embodiments of the present disclosure . With regard to the description of the figures, similar reference numerals may be used for similar components.
[0025] In the accompanying drawings, irrelevant descriptions will be omitted to clearly describe the present disclosure, and thicknesses may be exaggerated for clearly expressing various layers and regions. The same reference numerals will be used to describe the same elements having the same function within the scope of the same concept. Throughout the specification, unless specifically stated otherwise, when a component is referred to as "comprising" or "compri...
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Abstract
The present disclosure provides a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode; and a second external electrode, in which the ceramic body includes: a capacitance forming portion including the first internal electrode and the second internal electrode stacked in a second direction to form a capacitance; a first edge portion; a second edge portion; a first cover portion; and a second cover portion in which an average length of the ceramic body in the first direction satisfies a range from more than one time an average width a of the ceramic body in the second direction to less than three times the average width a of the ceramic body in the second direction, the average width a of the ceramic body in the second direction and the average height b of the ceramic body in the third direction satisfy bgt; and a.
Description
[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0182056 filed in the Korean Intellectual Property Office on December 23, 2020, the disclosure of which is incorporated herein by reference in its entirety. technical field [0002] The present disclosure relates to a multilayer ceramic electronic assembly and a board for mounting the same. Background technique [0003] In general, electronic components (such as capacitors, inductors, piezoelectric elements, varistors, or thermistors, etc.) using ceramic materials may include a ceramic body made of ceramic materials, internal electrodes formed inside the body, and mounting On the surface of the ceramic body to connect the outer electrode to the inner electrode. [0004] In recent years, with the miniaturization and multifunctionalization of electronic products, chip components have also been miniaturized and manufactured to be highly functional. Therefore, multilayer ceramic ele...
Claims
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IPC IPC(8): H01G4/30H01G2/02H01G4/012
CPCH01G4/30H01G2/02H01G4/012H01G4/224H01G4/12H01G4/1227H01G4/232H01G2/06H01G4/1209H01G2/065
Inventor 权炳灿李志勳
Owner SAMSUNG ELECTRO MECHANICS CO LTD