Temperature control clamping device, crimping box and error code testing device

Abstract

The invention provides a temperature control clamping device, a crimping box and an error code testing device, and belongs to the technical field of digital communication. The temperature control clamping device comprises a fixed substrate; the air cylinder is provided with a telescopic plunger rod; the air cylinder supporting plate is fixedly connected with the fixed base plate and used for fixing the air cylinder; the movable push plate is located below the air cylinder supporting plate and fixedly connected with the plunger rod. The limiting plate is fixedly connected with the fixed substrate and is used for penetrating through the optical module; the upper temperature control module is positioned above the optical module and is hung at the movable push plate through a first fastener; the lower temperature control module is positioned below the optical module; the pressing block structure is hung at the movable push plate through a second fastener; the lever plate is rotationally connected with the fixed base plate through a rotating shaft, the axis of the rotating shaft is horizontally arranged, and the upper surfaces of the two ends of the lever plate are opposite to the bottom of the pressing block structure and the bottom face of the lower temperature control module respectively. According to the temperature control clamping device, the crimping box and the error code testing device, the surface quality of the optical module can be ensured.

Description

technical field [0001] The invention relates to the technical field of digital communication, in particular to a temperature control clamping device, a crimping box and a code error testing device. Background technique [0002] In the current optical module test, the current conventional practice is to use screws or elbow clips to fasten the module to the temperature control module (semiconductor cooling chip + heat sink + water cooling head). Because the optical module needs to be in good contact with the heat sink, the module is prone to scratches during the process of plugging and unplugging. Some optical module manufacturers will use a kind of thin and wear-resistant medium such as high temperature tape to be placed between the optical module and the heat sink, which will improve the appearance of the optical module by losing the test efficiency. SUMMARY OF THE INVENTION [0003] An object of the first aspect of the present invention is to provide a temperature-contro...

AI Technical Summary

Problems solved by technology

Because the optical module needs to be in good contact with the heat sink, it is easy to scratch the module during the insertion and removal process

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