Intelligent control system and control method of semiconductor chip high-precision mounting all-in-one machine

Abstract

The invention discloses an intelligent control system and control method for a semiconductor chip high-precision mounting all-in-one machine, belongs to the technical field of chip mounting control systems, solves the problems of low mounting efficiency and poor accuracy, and comprises a feeding mechanism, an image collector, a processor, a database and a chip adsorption mechanism, the image collector is used for collecting images of the chip, the substrate and the carrier plate and sending the collected images of the chip, the substrate and the carrier plate to the processor, and the processor obtains features of the chip, the substrate and the carrier plate through processing and analysis, obtains qualified features and sends the qualified features to the database in a data form. And obtaining the positions of the unqualified substrates to report errors. The production efficiency is improved, tedious procedures of production are reduced, the application range is wide, a high-efficiency operation mode is provided for batch mounting, and a basis is provided for quick search of defective parts.

Description

technical field [0001] The invention relates to the technical field of chip mounting control systems, in particular to an intelligent control system and a control method of a semiconductor chip high-precision mounting integrated machine. Background technique [0002] Chips are also called microcircuits, microchips, and integrated circuits (IC). It refers to silicon wafers containing integrated circuits, which are small in size and are often part of computers or other electronic equipment. The role of electrical and mechanical connections needs to be controlled by the control system in the actual operation process, so as to achieve high-precision automatic placement. [0003] The patent No. CN201310430830.3 discloses a placement control method and system for placement of components by a placement machine. The method includes the following steps: S1. Establish a standard placement component feature library; S2. When the placement component is adsorbed to the When the suction...

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Problems solved by technology

However, the above-mentioned patent does not need to input the image information of the standard mounting original into the control system in advance, so as to form a comparison, the procedure is complicated, and each time a new standard mounting original is produced, it needs to be manually entered once, resulting in low production efficiency. Mounting originals that have not been entered cannot be placed and processed. Due to the limitation of input standard information, the scope of application is narrow, and there is no follow-up processing for unqualified placement originals during the placement process, and it cannot be applied to large-scale batch placement production. Requires a lot of manual assistance

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