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Diamond film perforation processing method and system

A diamond film and diamond layer technology, which is applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of surface burning and reducing the surface flatness of diamond film, etc.

Pending Publication Date: 2022-07-01
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in laser perforation, spatter will be ejected outward, and these spatters will fall on the surface of the diamond film, which will cause surface burning and reduce the surface flatness of the diamond film.

Method used

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  • Diamond film perforation processing method and system
  • Diamond film perforation processing method and system
  • Diamond film perforation processing method and system

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Embodiment Construction

[0056] The embodiments of the present application provide a method for perforating a diamond film, and the method can be applied to a system for perforating a diamond film, such as figure 1 As shown, the system may include a processing table 1, a liquid jet 2 and a laser 3, wherein the processing table 1 is used for fixing the diamond film 4 to be perforated, and the liquid jet 2 is located on the side of the processing table 1, and is used to locate the processing table 1. The surface of the diamond film 4 on the surface of the table 1 continues to spray liquid to form a liquid film 5, and the laser 3 is located above the processing table 1 for radiating a laser beam to the diamond film 4 located on the surface of the processing table 1 to obtain a through hole. Diamond film 4.

[0057] In the following, in conjunction with specific implementations, the figure 2 The shown diamond film perforation process is described in detail, and the content can be as follows:

[0058] I...

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PUM

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Abstract

The invention discloses a diamond film perforation processing method and system, and belongs to the field of laser perforation. The method comprises the steps that a diamond film to be perforated is fixed to the surface of a machining table; a liquid sprayer is used for continuously spraying liquid on the surface, away from the machining table, of the diamond film so as to form a flowing liquid film; and using a laser to radiate a laser beam on the surface, far away from the diamond film, of the liquid film to obtain the diamond film with the through hole. By the adoption of the liquid film spraying method and device, sprayed splash floats on the surface of the liquid film and is separated from the diamond film along with flowing of the liquid film, burning of the splash to the surface of the diamond film can be reduced or even avoided, and then the surface flatness of the diamond film is improved.

Description

technical field [0001] The present application relates to the technical field of laser perforation, and in particular, to a method and system for perforating a diamond film. Background technique [0002] Diamond has good thermal conductivity. As the diamond chemical vapor deposition (Chemical Vapor Deposition, CVD) technology becomes more and more mature, the diamond film is used more and more widely as a heat dissipation medium. [0003] When the diamond film is in use, it needs to be perforated so that the two parts on the upper and lower surfaces of the diamond film can be electrically connected. Laser perforation is a common perforation method. In laser perforation, a high-energy laser beam is irradiated on the diamond film, and the diamond film at the focus point is instantly melted to form a through hole. [0004] However, in the laser perforation, spatters will be sprayed outward, and these spatters will fall on the surface of the diamond film, causing surface burnin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/60B23K26/70
CPCB23K26/382B23K26/389B23K26/60B23K26/70
Inventor 魏潇赟王俊友杨勇邓抄军汪波
Owner HUAWEI TECH CO LTD