MEMS microphone structure
A technology of microphone and back pole, which is applied in the field of microphones, can solve problems such as cracks and device damage, and achieve the effects of avoiding damage due to cracks, reducing stress concentration, and improving mechanical reliability
Pending Publication Date: 2022-07-01
瑶芯微电子科技(上海)有限公司
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Problems solved by technology
[0003] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of MEMS microphone structure, is used to solve the effect that the junction of back pole and back plate of MEMS microphone in the prior art is easily subjected to the effect of stress concentration and produces crack, makes The problem of device damage
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[0054] The embodiments of the present invention are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
[0055] see Figure 1 to Figure 7 . It should be noted that the drawings provided in this embodiment are only to illustrate the basic concept of the present invention in a schematic way, so the drawings only show the components related to the present invention rather than the number, shape and the number of components in actual implementation. For dimension drawing, the type, quantity and proportion of each component can be arbitrarily chang...
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The invention provides an MEMS microphone structure, which comprises a vibrating diaphragm, a back electrode, a back plate, a central sound hole and a plurality of peripheral sound holes, and is characterized in that the back electrode is located above the vibrating diaphragm, and a preset distance is formed between the back electrode and the back electrode in the vertical direction to form an air gap; at least one part of the back plate is connected to the upper surface of the back electrode to support the back electrode; the central sound hole is located in the center of the back electrode and penetrates through the back electrode and the back plate in the vertical direction. The plurality of peripheral sound holes are distributed on the periphery of the central sound hole and are distributed in a concentric circle mode with the central sound hole as the center, and the edge of the back pole does not pass through any peripheral sound hole. The arrangement and distribution mode of the sound holes is optimized, the edge of the back electrode can be easily controlled to be located between the two circles of peripheral sound holes which are distributed in a concentric circle mode, the edge of the back electrode does not intersect with the back plate with the sound holes, and therefore stress concentration at the junction of the edge of the back electrode and the back plate is effectively reduced; and the damage caused by cracks generated by the part which is easily subjected to the stress concentration effect is avoided, so that the mechanical reliability of the MEMS microphone is improved.
Description
Technical field [0001] The invention belongs to the field of microphone technology and relates to a MEMS microphone structure. Background technology [0002] Today's smartphones and smart speakers use microphones made with MEMS (Micro-Electro-Mechanical System) technology. This kind of microphone has the characteristics of small size, low power consumption, excellent performance, good consistency and easy assembly. The MEMS microphone structure has an insulating backplate structure that is used to fix the back electrode for support. In order to allow external sound waves to reach the diaphragm, corresponding sound holes are opened on the back electrode and the back plate. However, stress concentration will occur at the interface between the edge of the back electrode and the sound hole on the back plate. In order to reduce this effect, requirements are put forward for the design of the sound hole arrangement. Contents of the invention [0003] In view of the above shortc...
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IPC IPC(8): H04R19/00H04R19/04
CPCH04R19/005H04R19/04
Inventor 王青松
Owner 瑶芯微电子科技(上海)有限公司