Polishing pad hole pricking equipment and polishing pad hole pricking method

Abstract

The invention provides polishing pad hole pricking equipment and a hole pricking method. The polishing pad pricking equipment comprises a bearing table, a pricking device and a driving device. The bearing table is used for placing a polishing pad to be punctured; the hole pricking device is located above the bearing table, and the hole pricking device comprises pricking needles and is used for conducting hole pricking operation on the polishing pad; the driving device is connected with the bearing table and / or the hole pricking device and used for driving the bearing table and / or the hole pricking device to move in the horizontal direction so as to conduct hole pricking operation on the preset position of the polishing pad. The control device is connected with the hole pricking device and the driving device so as to control operation of the hole pricking device and the driving device. According to the improved structural design, the control device controls the hole pricking device to conduct automatic hole pricking operation on the polishing pad, the consistency of the hole pricking position, interval and depth can be ensured, the surface flatness of the polishing pad is effectively improved, the problem of needle breakage caused by improper force during manual needle pricking can be effectively solved, and the production efficiency is improved. And the subsequent polishing yield can be improved.

Description

technical field [0001] The invention relates to the field of silicon wafer manufacturing, in particular to a polishing pad drilling equipment and a polishing pad drilling method. Background technique [0002] The polishing process is an important process in the silicon wafer manufacturing process. The step of improving the surface flatness of the silicon wafer by polishing determines the final morphology of the silicon wafer surface, which has a very important impact on the subsequent semiconductor device manufacturing yield. Therefore, various parameters in the polishing process, such as the flatness of the polishing pad , polishing head rotation speed, etc. must be strictly managed. [0003] In the double-sided polishing process of silicon wafers, polishing pads are attached to the upper and lower platens, the polishing liquid is poured into the upper platen, and the silicon wafers are placed on the planetary wheel. For the purpose of polishing, the surface flatness of t...

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Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the object of the present invention is to provide a polishing pad piercing device and a polishing pad piercing method, which are used to solve the problem of using a roller-type needle roller tool with multiple needles mounted on the surface in the prior art. For manual rolling of the polishing pad, it is difficult to achieve the same installation height among the needles, and it is difficult to achieve the same position, interval and depth of the needle hole due to manual operation, resulting in polishing The flatness of the pad surface is poor; and multiple needles on the needle rolling tool are rolled at the same time for piercing operation. During the rolling process, the needle tip is subjected to a large torque, which is prone to broken needles. The broken needles fall on the polishing pad and are not easy to detect. The product will be scratched in the middle, and there will be a large gap in the position of the broken needle during rolling, and the pinhole cannot be pierced. When the polishing pad is attached to the fixed plate, the air bubbles cannot be effectively removed, resulting in poor flatness of the polished product, etc.

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