Processing method of PCB with golden fingers and PCB

Abstract

The invention provides a processing method of a PCB with a golden finger and the PCB, and belongs to the technical field of circuit board processing, the method comprises the following steps: outer layer etching: forming an outer layer circuit pattern and a golden finger part on a substrate, and etching a golden finger lead at the side corner of the golden finger part; solder mask: performing solder mask protection on the substrate subjected to outer layer etching; a wet film is selectively plated, and the golden finger wire is covered with the wet film after solder mask; gold finger plating: plating nickel and gold with required thickness on the gold finger part; carrying out dry film image transfer, removing the wet film, pasting the dry film on the substrate, and carrying out image transfer; performing external alkali etching to etch away the golden finger wire and remove the dry film; and testing: performing electrical detection on the molded circuit board. The method can overcome the defect of lead residue or gold suspension in the golden finger manufacturing process in the prior art, and can improve the processing quality of the circuit board golden finger.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a processing method of a PCB board with golden fingers and the PCB board. Background technique [0002] The connecting finger is a component that transmits signals on computer hardware such as: (between the memory stick and the memory slot, the graphics card and the graphics card slot, etc.). The golden finger is composed of many golden-yellow conductive contacts, which are called "gold fingers" because the surface is gold-plated and the conductive contacts are arranged like fingers. As the signal transmission rate is getting higher and higher, the quality requirements for gold fingers in the market are also getting higher and higher. The current practice of making gold fingers in the industry is to pull the gold-plated wire directly under the gold finger, and then remove the gold-plated gold finger wire by bevelling or etching after gold-plating. Using the met...

AI Technical Summary

Problems solved by technology

There will be gold finger wire residue in the method of cutting off the oblique edge, and the wire residue will affect the transmission rate of the signal

However, if the gold-plated wire is pulled directly under the gold finger, there is a risk of the gold finger hanging from the gold. The gold hanging from the gold finger is easy to fall off during the insertion and removal process. If it falls around the component, there will be a risk of short circuit.

[0003] Therefore, a gold finger production method is needed to avoid the problem of wire residue or hanging gold in the gold finger manufacturing process

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