Connection, electrical through and sensor
A through-piece, mating connection technology, applied in the parts, connections, capacitors and other directions of the connecting device, can solve problems such as deformation and damage to thin metal components
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0060] figure 1 A schematic partial view of the connection 1 according to one possible embodiment is shown.
[0061] The connection 1 is the connection of the alloy element 2 to the ceramic element 3 by means of a glass adhesive 4 . The glass adhesive 4 is connected to the alloy element 2 by means of a material-fit connection 24 . Furthermore, the glass adhesive 4 is connected to the ceramic element 3 by means of a material-fit connection 34 . The glass binder 4 has a melting point below 800°C. The respective material-fit connections 24 , 34 to the ceramic element 3 and the alloy element 2 respectively take place at a temperature slightly above the melting temperature of the glass adhesive 2 . In the following, low temperature refers to a temperature below 800°C, and high temperature refers to a temperature above 800°C. The low melting temperature of the glass binder 4 is achieved by the glass binder 4 having a proportion of bismuth of at least 10%.
[0062] The low melti...
PUM
| Property | Measurement | Unit |
|---|---|---|
| melting point | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
| melting point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


