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Connection, electrical through and sensor

A through-piece, mating connection technology, applied in the parts, connections, capacitors and other directions of the connecting device, can solve problems such as deformation and damage to thin metal components

Pending Publication Date: 2022-07-15
KISTLER HLDG AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such high temperatures can damage especially thin metal components, e.g. by irreversible deformation

Method used

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  • Connection, electrical through and sensor
  • Connection, electrical through and sensor
  • Connection, electrical through and sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] figure 1 A schematic partial view of the connection 1 according to one possible embodiment is shown.

[0061] The connection 1 is the connection of the alloy element 2 to the ceramic element 3 by means of a glass adhesive 4 . The glass adhesive 4 is connected to the alloy element 2 by means of a material-fit connection 24 . Furthermore, the glass adhesive 4 is connected to the ceramic element 3 by means of a material-fit connection 34 . The glass binder 4 has a melting point below 800°C. The respective material-fit connections 24 , 34 to the ceramic element 3 and the alloy element 2 respectively take place at a temperature slightly above the melting temperature of the glass adhesive 2 . In the following, low temperature refers to a temperature below 800°C, and high temperature refers to a temperature above 800°C. The low melting temperature of the glass binder 4 is achieved by the glass binder 4 having a proportion of bismuth of at least 10%.

[0062] The low melti...

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Abstract

The invention relates to a connection (1), in which an alloy element (2) is connected to a ceramic element (3) by means of a glass binder (4); the glass binder is connected to the alloy element by means of a material-fit connection (24) and to the ceramic element by means of another material-fit connection (34); the glass binder is made of glass with the melting point lower than 800 DEG C; the thermal expansion coefficient of the glass binder is at least 9 * 10 <-6 > K <-1 >; the bismuth content of the glass binder is at least 10%; the thermal expansion coefficient of the alloy element is at least 9 * 10 <-6 > K <-1 >; the maximum thermal expansion coefficient of the ceramic element is 8 * 10 <-6 > K <-1 >; the cohesive connection (34) of the glass binder to the ceramic element has a mixing region (10); the mixing region (10) is a sub-region of the ceramic element (3); the bismuth content of the mixing region (10) is higher than the bismuth content of the ceramic element (3) outside the mixing region (10).

Description

technical field [0001] The invention relates to a connection which connects an alloy element to a ceramic element by means of a glass adhesive, wherein the glass adhesive is connected to the alloy element by a cohesive connection and to the ceramic element by another cohesive connection. The invention also relates to an electrical feedthrough comprising the above connection. The invention also relates to a sensor comprising at least one such electrical feedthrough. Background technique [0002] Heat-resistant material-fit connections between different materials are required in many industrial products. In this case, the two elements to be connected are usually connected in a cohesive manner by means of an adhesive. Heat-resistant material-fit connections between ceramic elements and metal alloys (abbreviated as alloys) or alloy elements made of metals often present challenges due to the different coefficients of thermal expansion or severely limit the choice of materials. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02C03C8/24
CPCC04B37/023C03C8/24C04B2237/10H01G9/10H01G4/35H01G2/103H01B7/02C03C3/066C03C3/15C03C3/155H01R13/5216H01R13/405C03C3/122C03C27/00H01B3/00H01C1/14H01G9/08H01R13/74F16B11/006G01L1/18C09J1/00C03C27/042G01D11/245H01B17/305
Inventor G·马斯特罗贾科莫H·B·梅尔奇托马斯·卡德努
Owner KISTLER HLDG AG