Resin composition

A resin composition and compound technology, applied in synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problem of reduced stain removal, accelerated substrate copper adhesion strength, and reduced elongation at break, etc. problems, to achieve the effects of excellent copper plating peel strength and stain removal, low dielectric loss tangent, and excellent copper foil peel strength

Pending Publication Date: 2022-07-19
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the case of using an epoxy resin composition containing an active ester compound, a decrease in stain removability is a problem.
In addition, when a low-molecular-weight (meth)acrylate compound is used, the stain removability can be improved (Patent Document 2), but the arithmetic mean roughness (Ra) and copper plating peeling strength of the surface of the insulating layer after the roughening treatment issues
[0005] In addition, in the case of using an epoxy resin composition containing a high content of an active ester compound and an inorganic filler, the decrease in the elongation at break, the base copper adhesion strength (copper foil peel strength) after the accelerated environmental test (HAST) ) reduction etc. are also issues

Method used

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Examples

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Embodiment

[0327] Hereinafter, the present invention will be specifically described by way of examples. The present invention is not limited by these examples. In addition, hereinafter, unless otherwise specified, "parts" and "%" indicating amounts mean "parts by mass" and "% by mass", respectively. When the temperature and pressure are not specified, the temperature conditions and the pressure conditions are room temperature (23° C.) and atmospheric pressure (1 atm), respectively.

[0328]

[0329] While stirring, 2 parts of bisphenol type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., a 1:1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent of about 169 g / eq.), And 8 parts of naphthol-type epoxy resins ("ESN475V" by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., epoxy equivalent of about 330 g / eq.) were heated and dissolved in 5 parts of solvent naphtha. This was cooled to room temperature to prepare a dissolved compositio...

Embodiment 2

[0331] In place of 4 parts of acrylate ("A-DOG" manufactured by Shin-Nakamura Chemical Co., Ltd.), 4 parts of acrylate ("DCP-A" manufactured by Kyoeisha Chemical Co., Ltd., (meth)acryloyl equivalent of about 152 g / eq.) were used , instead of 30 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation), an active ester compound ("HPC-8150-62T" manufactured by DIC Corporation), active ester group equivalent of about 220 g / eq., non-volatile content A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that the phenoxy resin (“YX7553BH30” manufactured by Mitsubishi Chemical Corporation) was not used in 30 parts of a toluene solution of 62 mass %.

Embodiment 3

[0333] The usage amount of the 50% MEK solution of the allyl compound having an alicyclic structure ("FATC-809" manufactured by Kunei Chemical Industry Co., Ltd.) was changed from 4 parts to 8 parts, instead of the active ester compound ("HPC-809" manufactured by DIC Corporation). 8000-65T") and 30 parts of an active ester compound ("HPC-8150-62T" manufactured by DIC Corporation, an active ester group equivalent of about 220 g / eq., a toluene solution with a nonvolatile content ratio of 62 mass %) 30 parts, It was prepared in the same manner as in Example 1, except that the amount of acrylate (“A-DOG” manufactured by Shin-Nakamura Chemical Co., Ltd.) was changed from 4 parts to 2 parts, and the phenoxy resin (“YX7553BH30” manufactured by Mitsubishi Chemical Corporation) was not used. Resin composition (resin varnish).

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Abstract

The present invention addresses the problem of providing: a resin composition with which it is possible to obtain a cured product having excellent copper plating peel strength and stain removability, while suppressing the arithmetic average roughness (Ra) of the surface of an insulating layer after roughening treatment to a low level; and a resin composition from which a cured product having a low dielectric loss tangent (Df) and excellent base copper adhesion strength (copper foil peel strength) after an accelerated environment test (HAST) and elongation at break can be obtained. The solution of the present invention is: a resin composition containing (A) an allyl compound having an alicyclic structure, (B) an epoxy resin, and (C) an active ester compound; and a resin composition containing (A) an allyl compound having an alicyclic structure, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, the content of the component (C) being 10% by mass or more when the non-volatile components in the resin composition are 100% by mass, and the content of the component (C) being 10% by mass or more when the non-volatile components in the resin composition are 100% by mass, and the content of the component (C) being 10% by mass or more when the non-volatile components in the resin composition are 100% by mass. The content of the component (D) is 60 mass% or more.

Description

technical field [0001] The present invention relates to resin compositions comprising epoxy resins. Furthermore, it relates to the hardened|cured material, sheet-like laminated material, resin sheet, printed wiring board, and semiconductor device obtained using this resin composition. Background technique [0002] As a manufacturing technique of a printed wiring board, a manufacturing method using a buildup method in which insulating layers and conductor layers are alternately overlapped is known. In the manufacturing method using the stacking method, generally, the insulating layer is formed by curing the resin composition. In recent years, it is required to suppress the dielectric loss tangent of the insulating layer to be low. [0003] Heretofore, it has been known that the dielectric loss tangent of the insulating layer can be kept low by using an epoxy resin composition containing an active ester compound as a resin composition for forming an insulating layer (Patent ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F220/10C08K9/06C08K7/18C08J5/18C08L51/08B32B17/02B32B15/20B32B15/14B32B15/09B32B27/36
CPCC08F283/10C08K9/06C08K7/18C08J5/18B32B5/02B32B15/20B32B15/14B32B15/09B32B27/36C08J2351/08B32B2262/101B32B2260/021B32B2260/046B32B2307/206B32B2307/744B32B2457/08C08F220/10C08G59/42C08G59/4284C08G59/4042C08G59/621C08L63/00C08K5/01C08K5/10B32B27/38H05K1/0373C08K3/013C08K3/36
Inventor 中村洋介
Owner AJINOMOTO CO INC
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