Sensor structure

Abstract

The invention discloses a sensor structure. A probe and an electric connector socket are fixed at two ends of a shell; the first circuit board assembly is fixed on the second circuit board assembly, the sensitive body, the first circuit board assembly and the second circuit board assembly are all fixed in the shell, and the probe is connected with the sensitive body; the sensitive element is adhered to the sensitive body; the conditioning element is an aggregate of signal conditioning elements and is fixed on the second circuit board assembly; the heating element is fixed on the first circuit board assembly; the sensitive element and the second circuit board assembly are conducted through the connecting wire; the first circuit board assembly is connected with the electric connector socket through a wire. The sensor provided by the invention can continuously work for a long time at the limit working temperature and the limit working voltage; meanwhile, the volume and the weight of the sensor are not additionally increased.

Description

technical field [0001] The invention belongs to the technical field of aviation equipment, and relates to a sensor structure. Background technique [0002] High-temperature pressure, temperature and other sensors are also widely used in aviation and military, mainly to solve the measurement of various gas and liquid pressure and temperature parameters in high-temperature environments, such as pipelines, high-temperature reaction vessels, and medium pressure or near the engine. temperature etc. In these applications, the sensors work in high temperature environment, which makes the built-in circuit of the sensor very easy to fail. This is also the difficulty in the design of sensors such as high temperature pressure and temperature. Design difficulty. At present, the commonly used solution is to separate the sensor head from the back-end processing circuit, place the processing circuit including power excitation and signal acquisition and processing in a non-high temperatur...

AI Technical Summary

Problems solved by technology

At present, the commonly used solution is to separate the sensor head from the back-end processing circuit, place the processing circuit including power supply excitation and signal acquisition and processing in a non-high temperature environment, or increase the sensor structure, and use ceramics and other heat-insulating materials to separate the back-end processing circuit. Dealing with circuit wrapping to isolate the high temperature environment, both methods solve the problem at the cost of increasing the size and weight of the sensor, which increases the burden on the application

Images