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Stacked semiconductor device and method of manufacturing the same

A technology of semiconductors and oxide semiconductors, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., and can solve problems such as area reduction

Pending Publication Date: 2022-07-29
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, simple stacking or stacking of two semiconductor devices may not reduce the area by at least 50% due to the middle-of-the-line (MOL) structure that directly or indirectly connects the lower-stacked transistors to the upper-stacked transistors.

Method used

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  • Stacked semiconductor device and method of manufacturing the same
  • Stacked semiconductor device and method of manufacturing the same
  • Stacked semiconductor device and method of manufacturing the same

Examples

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Embodiment Construction

[0015] The embodiments described herein are all example embodiments, and thus, the inventive concept is not limited thereto and may be implemented in various other forms. It does not preclude that each embodiment provided in the following description is associated with one or more features of another example or another embodiment, also provided or not provided herein, but consistent with the inventive concept. For example, even if an item described in a particular example or implementation is not described in a different example or implementation, the matter may be construed as related to or in conjunction with that different example or implementation unless in the description mentioned additionally. Furthermore, it should be understood that all descriptions of the principles, aspects, examples, and embodiments of the inventive concept are intended to encompass both structural and functional equivalents thereof. Furthermore, these equivalents should be understood to include n...

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Abstract

The invention provides a stacked semiconductor device and a method of manufacturing the same. The stacked semiconductor device includes: a substrate; a first transistor formed on the substrate and including a first active region surrounded by a first gate structure and a first source / drain region; and a second transistor stacked on the first transistor and including a second active region surrounded by a second gate structure and a second source / drain region, where the first active region and the first gate structure are in vertical mirror symmetry with the second active region and the second gate structure, respectively, with respect to a dummy plane therebetween.

Description

technical field [0001] Apparatuses and methods consistent with example embodiments of the inventive concept relate to stacked semiconductor devices, and more particularly, to structures of stacked semiconductor devices having mirror-symmetrical structures. Background technique [0002] The increasing demand for miniaturization of semiconductor devices has introduced fin field effect transistors (finFETs) beyond planar structure transistors, and further, nanosheet transistors, also known as multi-bridge channel FETs (MBCFETs). Both finFETs and nanosheet transistors are referred to as gate-all-around transistors because the structure they provide for the current path is wrapped or surrounded by the gate structure. [0003] In order to concentrate semiconductor devices including finFETs or nanosheet transistors driving larger amounts of current in a limited layout area, three-dimensional stacked device structures have been investigated. However, simple stacking or stacking of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/088H01L21/8234
CPCH01L27/088H01L21/823412H01L21/823437H01L21/823431H01L27/0886H01L21/8221H01L27/0688H01L27/092H01L27/0924H01L21/823842H01L21/823878H01L21/823481H01L21/823475H01L21/823871H01L21/823821H01L21/823807H01L21/823814H01L21/823885H01L21/823418H01L21/823487H01L29/785H01L29/78696H01L29/7827H01L29/66795H01L29/66666H01L29/66545H01L21/823828H01L27/0922
Inventor 宋昇炫洪炳鹤全辉璨黃寅灿
Owner SAMSUNG ELECTRONICS CO LTD
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