Device and method for rapidly and efficiently screening uniform solder balls

A uniform and high-efficiency technology, applied in transportation and packaging, metal processing equipment, etc., can solve the problems of long ball forming interval, affecting ball making efficiency, increasing solder ball preparation process, etc., to avoid secondary screening and save production costs Effect

Pending Publication Date: 2022-08-05
NORTH CHINA INST OF AEROSPACE ENG
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a device and method for fast and efficient screening of uniform solder balls, to solve the problem that most of the ball forming cooling devices in the preparation of solder balls using jet disturbance technology are formed into balls in a specific medium, and the ball forming interval is long. And it does not have the function of separation and screening, and cannot separate good and bad solder balls in time, which affects the ball making efficiency. It can only be realized by multiple screenings in the later stage, which increases the solder ball preparation process to a certain extent and increases the cost of solder ball preparation.

Method used

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  • Device and method for rapidly and efficiently screening uniform solder balls

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Embodiment Construction

[0027] like figure 1 As shown, a device for quickly and efficiently screening uniform solder balls includes a uniform metal droplet preparation device 1 and a rapid cooling pipe 16 .

[0028] Both sides of the uniform metal droplet preparation device 1 are provided with melting heating coils 2, the uniform metal droplet preparation device 1 is provided with a temperature sensor 3, and the melting heating coil 2 and the temperature sensor 3 are connected with the intelligent PID temperature control. Instrument 4 is electrically connected.

[0029] A spherical cavity 5 is provided at the lower end of the uniform metal droplet preparation device 1 , and observation windows 6 are provided on both sides of the spherical cavity 5 .

[0030] The nozzle of the uniform metal droplet preparation device 1 extends into the spherical cavity 5, and the upper end of the rapid cooling pipe 16 extends into the spherical cavity 5 and cooperates with the nozzle. The rapid cooling pipe 16 is pro...

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Abstract

The invention discloses a device and method for rapidly and efficiently screening uniform solder balls. Uniform solder balls are screened out through cooperation of an automatic screening device and a rapid and efficient ball forming device. The device is suitable for high-frequency and high-quality preparation of micro solder balls for electronic packaging and balling and screening of other metal microparticles based on the jet flow disturbance technology. Comprising a uniform metal microdroplet preparation device, a cooling balling system and an automatic screening system. The uneven metal solder balls generated in the initial stage of solder ball preparation and the end stage of the solder ball preparation process are accurately screened out by reasonably adjusting the pressure in the uniform metal microdroplet preparation device and the screening switching time of the cooler, the method is simple and easy to implement, the secondary screening process is avoided, and the production cost is saved.

Description

technical field [0001] The invention relates to the field of solder ball production equipment, in particular to a device and method for quickly and efficiently screening uniform solder balls. Background technique [0002] As an indispensable material in advanced packaging, uniform solder balls can be used to replace pins in IC component packaging structures to meet electrical interconnection and mechanical connection requirements. The development of BGA (Ball Grid Array) and CSP (Chip Level Package) packages conforms to the trend of technological development and meets people's requirements for short, small, light and thin electronic products. However, when the uniform solder balls are currently prepared by the jet disturbance technology, the collected solder balls include the uneven metal solder balls generated in the initial stage of solder ball preparation and the end stage of the solder ball preparation process. Solder balls that meet the requirements increase the solder...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08B22F1/065
CPCB22F9/082B22F2009/0824B22F2009/0896B22F2009/0848B22F2009/0888
Inventor 王同举冷启顺张文倩雷永平刘亚浩
Owner NORTH CHINA INST OF AEROSPACE ENG
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