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Display substrate, manufacturing method thereof and display device

A technology for displaying substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc. It can solve problems such as hole dark rings and affect the performance of thin film transistors, so as to reduce the generation of reflected light and relieve hole dark rings. Phenomenon, the effect of reducing light

Pending Publication Date: 2022-08-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current full-screen design is to place cameras and other equipment under the under-screen camera area of ​​the display panel. In order to ensure that the camera receives enough light, the transmittance of the under-screen camera area is relatively high, and the light-emitting elements in the under-screen camera area emit light. The light will enter the display panel, be reflected by the film layer of the display panel and then irradiate the surrounding pixel circuit, which will affect the performance of the thin film transistor in the pixel circuit, resulting in the phenomenon of hole dark ring

Method used

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  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device

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Embodiment Construction

[0050] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given in conjunction with the accompanying drawings and specific embodiments.

[0051] like figure 2 As shown, the display area of ​​the existing display substrate includes a first display area (the part inside the dashed frame) and the second display area (the part outside the dashed frame). The transmittance of the first display area is not set in the first display area, such as thin film transistors and other devices that affect the light. When the display substrate is displayed, such as figure 2 As shown in the figure, the light emitted by the light-emitting unit 04 in the first display area enters the display substrate, and is reflected at the interface between the substrate 01 and the air, and also at the interface between the adjacent film layers of the display panel. It is irra...

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Abstract

The invention provides a display substrate, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display substrate comprises a display area and a non-display area located on the periphery of the display area, the display area comprises a first display area and a second display area, and the display substrate comprises a substrate, a first light-emitting unit located on the substrate and arranged in the first display area, and a second light-emitting unit located on the substrate and arranged in the second display area. The display substrate further comprises a shading pattern located on the side, close to the substrate, of the first light-emitting unit, and the orthographic projection of the shading pattern on the substrate and the orthographic projection of a first electrode of the first light-emitting unit on the substrate are at least partially overlapped, the first light-emitting unit comprises a first electrode, a second electrode and a light-emitting layer located between the first electrode and the second electrode, and the transmittance of the first electrode is smaller than a preset threshold value. According to the technical scheme, the hole hidden ring phenomenon can be relieved.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) is a light-emitting device that uses organic solid-state semiconductors as light-emitting materials. Due to its simple preparation process, low cost, low power consumption, high light-emitting brightness, and wide operating temperature range Therefore, it has broad application prospects. [0003] In order to meet the user's demand for a larger screen ratio, the display panel is developing towards a full screen. The current full-screen design is to place cameras and other equipment under the under-screen camera area of ​​the display panel. In order to ensure that the camera receives enough light, the transmittance of the under-screen camera area is relatively high, and the light-emitting elements in the under-screen camera area...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/865H10K71/00
Inventor 蒋文娅孙世成卓永王萍银刘菲李佳翰于洋刘桂秀关丽文
Owner BOE TECH GRP CO LTD