Image splicing method and system in IC reverse engineering

Abstract

The invention discloses an image splicing method in IC reverse engineering, and the method comprises the following steps: S1, obtaining two to-be-spliced images with an overlapping region, taking one as a reference image I1, and taking the other as a to-be-registered image I2; s2, performing image registration on the reference image I1 and the to-be-registered image I2 based on a sequence template matching method; s3, based on the optimal matching point, performing image splicing on the reference image I1 and the to-be-registered image I2 by using a selective splicing method; and S4, performing image fusion by using a weighted average method to obtain a spliced image of the two to-be-spliced images. According to the method, the image registration efficiency is improved by using a sequence template matching method, then the splicing precision is improved by combining a selective splicing strategy, and finally the seamless fusion of the images is realized by using a weighted average method. According to the method, the splicing precision can be improved, and the splicing efficiency of microscopic images in IC reverse engineering is improved, so that the period of the whole IC reverse engineering is shortened, and the chip design speed is increased.

Description

technical field [0001] The invention belongs to the field of chip reverse analysis engineering, and in particular relates to an image stitching method and system in IC reverse engineering. Background technique [0002] Electronics are ubiquitous in every field of today's world. As the "heart" of electronic products, the demand for chips is increasing sharply, but the development and production speed of the chip industry still cannot meet the demand, and some high-end chips (such as CPU) still rely on imports. Chip design is the core of the chip industry, and improving the chip design capability and design speed is the key to promoting the development of the chip industry. In order to improve the competitiveness of enterprises, many enterprises adopt the method of reverse analysis of chip anatomy to learn advanced technologies, thereby improving their design capabilities. [0003] For miniaturized chips, in order to obtain high-definition microscopic images, image acquisiti...

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Problems solved by technology

[0004] In chip reverse analysis engineering, microscopic images of hundreds of chips need to be precisely stitched together. IC microscopic images are large in scale, complex in scenes, and small in overlapping areas. Nowadays, there are few stitching algorithms directly oriented to chip microscopic images in this field, and The accuracy of the algorithm is poor and the speed is slow. If the common traditional image stitching algorithm is directly used, it will lead to mis-stitching of IC microscopic images, which will undoubtedly prolong the overall IC reverse engineering cycle and reduce the production speed of the chip.

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