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Printed circuit board and electronic equipment with said printed circuit board

A technology of printed circuit boards and transmission lines, which is applied in the direction of printed circuits, printed circuit components, electrical connection printed components, etc., and can solve the problems of reducing transmission quality and so on

Inactive Publication Date: 2004-12-08
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These impedance changes have an adverse effect on the signal transmission on the transmission line, thereby reducing the transmission quality

Method used

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  • Printed circuit board and electronic equipment with said printed circuit board
  • Printed circuit board and electronic equipment with said printed circuit board
  • Printed circuit board and electronic equipment with said printed circuit board

Examples

Experimental program
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Embodiment Construction

[0020] An embodiment of a printed wiring board according to the present invention will now be described with reference to the accompanying drawings.

[0021] 1 and 2 show a portable computer 1 as an electronic device. The portable computer 1 includes a computer main body 2 and a display unit 3 supported by rotation of the computer main body 2 .

[0022] The computer main body 2 has a casing 4 as an outer casing. The housing 4 is in the shape of a flat box and contains a keyboard 6 on its upper surface 5 . The display unit 3 includes a flat box-shaped display housing 8 and a liquid crystal display panel 9 accommodated in the display housing 8 . The rear end of the housing 4 supports the display unit 3 using a hinge (not shown). Correspondingly, the display unit 3 can pivot between a closed position covering the keyboard 6 and an open position standing up and exposing the keyboard 6 , as shown in FIG. 1 .

[0023] The housing 4 contains a multilayer printed wiring board 11 ....

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PUM

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Abstract

A print board comprises a ground layer (14), an insulation layer (16), a signal layer (12) formed on the insulation layer, formed in a predetermined line pattern, and serving as a transmission line (17) for transmitting high-speed signals, and a pad (19) formed on the signal layer. The signal layer has a line width that satisfies a characteristic impedance required for the transmission line, and the width of the signal layer is set substantially equal to the width of the pad.

Description

technical field [0001] The present invention relates to a printed wiring board having a signal layer as a transmission line for high-speed signals, and electronic equipment such as a portable computer having the printed wiring board. Background technique [0002] A multilayer printed wiring board corresponding to an increase in signal transmission speed is widely used in a circuit system such as a Rambus memory for processing high-speed signals in the 1 GHz band. [0003] There is known a printed wiring board of the above type in which a signal layer and a ground layer both as surface layers are laminated with an insulating layer interposed therebetween. The signal layer is formed in a predetermined line pattern, and serves as a transmission line for transmitting high-speed signals. In such a conventional printed wiring board, the thickness of the insulating layer that separates the signal layer from the ground layer and the line width of the signal layer are set appropriat...

Claims

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Application Information

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IPC IPC(8): H01P3/08H05K1/00H05K1/02H05K1/11
CPCH05K1/025H01P3/081H05K1/0298H05K1/0268H05K1/117
Inventor 古贺裕一
Owner KK TOSHIBA
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