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Laser repair process

A technology of laser repair and laser ablation, which is applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as increased cost and complexity

Inactive Publication Date: 2005-02-23
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the known laser repair process, a photomask process must be used to form an opening in the second protective layer to expose the solder pad, so as to facilitate the subsequent formation of bumps on the solder pad.
The known application of the second protective layer and the formation of openings therein add cost and complexity to the process

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0033] refer to Figure 5 to Figure 9 , which are schematic flow charts representing the laser repair process according to the first embodiment of the present invention. First please refer to Figure 5 , providing a wafer with a plurality of chips 200 on the wafer, and only a single chip 200 is illustrated in the following figures. For example, a plurality of bonding pads 202 , a plurality of testing bonding pads 204 , a plurality of fuses 206 , and a protection layer 208 for protecting the surface of the chip 200 and exposing the bonding pads 202 and the testing bonding pads 204 are arranged on the chip 200 .

[0034] Then refer to Figure 6 1. A conductor layer 217 is formed on the chip 200. The conductor layer 217 is, for example, a multi-layer alloy structure such as titanium / copper alloy or aluminum / nickel / vanadium / copper formed by sputtering. Then, a patterned photoresist 216 is formed on the chip 200 . The patterned photoresist 216 has a plurality of openings 215 res...

no. 2 example

[0040] refer to Figure 10 to Figure 1 4. These figures are schematic flow charts representing the laser repair process according to the second embodiment of the present invention. first refer to Figure 10 , a wafer is provided, for example, there are a plurality of chips 300 on the wafer, and only a single chip 300 is illustrated in the following figures. The chip 300 is provided with a plurality of bonding pads 302 , a plurality of testing bonding pads 304 , a plurality of fuses 306 , and a protection layer 308 for protecting the surface of the chip 300 and exposing the bonding pads 302 and the testing bonding pads 304 .

[0041] Then refer to Figure 111. A conductor layer 317 is formed on the chip 300. The conductor layer 317 is, for example, a multi-layer alloy structure such as titanium / copper alloy or aluminum / nickel / vanadium / copper formed by sputtering. Next, a patterned photoresist 316 is formed on the chip 300 , for example, the patterned photoresist 316 covers e...

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PUM

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Abstract

A method of conducting a laser repair operation. A silicon wafer has a plurality of chips thereon. Each chip has a plurality of bonding pads, a plurality of testing pads, a plurality of fuses and a passivation layer for protecting the chip. The passivation layer exposes the bonding pads an the testing pads. A bump-forming process is conducted to form a bottom metallic layer and a bump sequentially over each bonding pad. Only a bottom metallic layer is formed over each testing pad. The bumps are formed, for example, by electroplating or printing. Testing is carried out by probing various bottom metallic layers above the testing pads. Finally, a laser repair is conducted.

Description

technical field [0001] The present invention relates to a laser repair process (laser repair), in particular to a laser repair process required for a wafer before a bumping process. Background technique [0002] The integrated circuit (integrated circuit) industry is basically a high-tech industry composed of four main systems: integrated circuit design, chip manufacturing, chip testing and chip packaging. After the general integrated circuit is manufactured, it must go through a series of tests to ensure the quality of the produced chip, and even use these test results to correct the process of the integrated circuit. After the wafer is manufactured, its native yield is usually quite low, so when the test finds that the circuit on the chip is defective or does not meet the requirements, a laser repair operation is usually performed, which is to use a laser to fuse the fuse. Blowing is performed so that redundant bit-lines designed in the chip repl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/485H01L23/525
CPCH01L2924/14H01L24/10H01L2924/01033H01L2924/01023H01L2924/01029H01L2224/13099H01L2924/01082H01L2924/01078H01L2924/01022H01L2924/10253H01L2224/1147H01L23/5258H01L2924/014H01L2924/01013H01L22/14H01L22/20H01L22/22H01L22/32H01L24/05H01L24/11H01L24/13H01L2224/03921H01L2224/05001H01L2224/05022H01L2224/05572H01L2224/11H01L2224/13H01L2924/12042H01L2924/00
Inventor 刘洪民
Owner UNITED MICROELECTRONICS CORP