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Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer

A control method and corrosive agent technology, applied in optics, analytical materials, color separation/tone correction, etc., can solve the problems of not being able to collect corrosive agents in real time, and unable to perform real-time corrosive agent analysis, etc.

Inactive Publication Date: 2005-08-03
DONGJIN SEMICHEM CO LTD
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  • Summary
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, currently commercially available on-line analytical equipment is at best capable of automated sampling and thus cannot perform the required real-time corrosive analysis
In addition, information on the processing of etchant used in the lithography process cannot be collected in real time with current commercially available on-line analysis equipment

Method used

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  • Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer
  • Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer
  • Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer

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Embodiment Construction

[0022] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0023] During the fabrication of semiconductor devices or liquid crystal displays, an etchant is sprayed onto a substrate which is then covered with a metal layer and a patterned photoresist, thus etching the metal layer through the photoresist pattern. Thereafter, the photoresist is removed leaving the desired pattern on the metal layer. At this time, the etchant containing etched metal residues is collected into an etchant collection box located below the substrate. When the amount of corrosive agent in the collection box reaches a predetermined value, the corrosive agent is delivered to the corrosive agent storage tank by a delivery pump. Since each component of the etchant has its own characteristic light absorption wavelength, the components of the etchant can be analyzed in real time by detecting the light absorption of the etchant in a near infra...

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Abstract

In a method of controlling a metallic layer etching process for fabricating a semiconductor device or a liquid crystal display device, the composition of the etchant used in etching the metallic layer is first analyzed with the NIR spectrometer. The state of the etchant is then determined by comparing the analyzed composition with the reference composition. In case the life span of the etchant comes to an end, the etchant is replaced with a new etchant. By contrast, in case the life span of the etchant is left over, the etchant is delivered to the next metallic layer etching process. This analysis technique may be applied to the etchant regenerating process in a similar way.

Description

technical field [0001] The present invention relates to a method for controlling a metal layer etching process based on a near-infrared (NIR) spectrometer and a method for regenerating an etchant used in the metal layer etching process, and more particularly, the present invention relates to a method that can automatically analyze in real time when manufacturing a semiconductor device or a liquid crystal display The composition of the etchant used in the photolithography process, so as to accurately and effectively control the etching process and regenerate the etchant, but shorten the required time period, the etching control method and the etchant regeneration method based on the NIR spectrometer. Background technique [0002] As large-scale semiconductor devices or liquid crystal displays become more and more options for electronic consumers, the number of solutions used to manufacture such devices has skyrocketed. In this case, these solutions should be used efficiently ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/05C23F1/00C23F1/16C23F1/46G01N21/35H01L21/306H01L21/3213
CPCH01L21/32134G01N21/359G01N21/3577C23F1/46G11B23/505C23F1/00H01L21/306
Inventor 李其范朴美仙金钟民金柄郁吴昌一
Owner DONGJIN SEMICHEM CO LTD
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