Method and appts. for end point triggering with integrated steering
A chemical-mechanical, end-point technology, applied in the direction of grinding devices, grinding machine parts, grinding/polishing equipment, etc., to achieve the effects of improving robustness and reliability, reducing the number of errors, and simplifying system settings
Inactive Publication Date: 2005-09-21
LAM RES CORP
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[0031] The present invention discloses an endpoint trigger mechanism with integrated belt manipulation in a CMP environment. Utilizing a sensor array, the present invention integrates endpoint detection trigger function and belt manipulation function in a single detection device. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some or all of these details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the present invention.
[0032] What Fig. 1A, 1B and Fig. 2 describe is a kind of prior art. image 3 A CMP system 300 according to one embodiment of the present invention is shown, including an endpoint trigger mechanism. The end point trigger mechanism is designed to include a sensor array 322 positioned belo...
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An invention is disclosed for end point triggering in a chemical mechanical polishing process. A sensor array is positioned beneath a polishing belt having an end point detection section, wherein the end point detection section can be an end point window, a hole in the polishing belt, or a translucent section of the polishing belt. The polishing belt is then rotated during the CMP process, and a transverse position of the end point detection section is determined based on a portion of the sensor array covered by a particular portion of the polishing belt. The particular portion of the polishing belt can be the end point window, a trigger slot, or a portion of the polishing belt covered by a reflective material. The sensor array can optionally be a charged coupled device (CCD), or a linear array of sensors. In operation, the positional information is determined based on which sensors are covered by the particular portion of the polishing belt. The positional information is then communicated to a belt steering system, which corrects the transverse position of the end point window based on which sensors are covered by the particular portion of the polishing belt.
Description
field of invention [0001] The present invention relates to a chemical mechanical polishing apparatus, and more particularly, to an endpoint trigger method and apparatus utilizing integrated manipulation in a chemical mechanical polishing system. Background technique [0002] Prior art chemical mechanical polishing (CMP) systems typically include belt, track, or brush stations in which a wafer is scrubbed, buffed, and polished using a belt, pad, or brush. To simplify and enhance CMP operations, abrasive slurries are used. The slurry is typically directed onto a moving preparation surface such as a belt, pad, brush, etc., and distributed over the preparation surface and the semiconductor wafer being buffed, polished or otherwise pretreated by a CMP process. This distribution is usually achieved through a combination of movement of the preparation surface, movement of the semiconductor wafer and friction created between the semiconductor wafer and the preparation surface. Add...
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IPC IPC(8): B24B49/02B24B21/04B24B37/013B24B49/12H01L21/304
CPCB24B49/12B24B21/04B24B37/013H01L22/00
Inventor J·M·博伊德H·E·利特瓦克
Owner LAM RES CORP