Regulating device and method of position deviation optical detecting device

Abstract

The object of present invention is to perform easy adjustment on the optical system of a device conducting detection of overlapped position-deviation. An optical device conducting detection of position-deviation comprises: an optical illumination system 10, for providing illumination to a testing mark 52; an optical imaging system 20, for focusing the light reflected from the testing mark and for forming an image of the testing mark; a CCD camera 30, for taking picture on the image of the testing mark generated by the optical imaging system 20; an image processing device 35, for detecting the position deviation of the testing mark from the resulting image signal; and a auto-focus device 40, for performing auto-focus adjustment. With such apparatus, it is possible to perform adjustment on detection error by carrying out the following adjustment operations in the order of adjusting auto-focus, adjusting the image opening aperture 23 of an optical imaging system 20, adjusting the second objective lens 21, and adjusting the illumination opening aperture 12 of the optical illumination system 10.

Description

technical field [0001] The present invention relates to an invention of an optical measurement device for positional deviation, which is used for optical measurement of the registration marks relative to the substrate in detection marks (marks that overlap each other) produced on a substrate to be inspected such as a wafer in a photolithography process of a semiconductor wafer. The position shift of the mark (shift of overlapping position), specifically, is the invention of the adjustment device and method of the position shift optical measuring device. Background technique [0002] In the semiconductor wafer photolithography process, which is one of the semiconductor chip manufacturing processes, resist patterns are formed on the wafer in several layers. That is, at each level, the formed pattern (called the substrate pattern) is superimposed on each other to form a prescribed resist pattern. In this case, since the resist pattern formed by overlaying the substrate pattern...

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Problems solved by technology

Moreover, due to the mutual influence of these several adjustment factors, the measurement error TIS produces subtle changes, so there is still the problem that it is very difficult to properly combine these several adjustment factors.

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