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Method and apparatus for circuit board continuity test, tool for continuity test

A technology for circuit substrates and inspection devices, applied in logic circuits, printed circuits, measuring devices, etc., can solve problems such as high impedance and inability to detect 10Ω-100Ω levels.

Inactive Publication Date: 2006-01-04
OHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the non-contact-contact method has the disadvantage of not being able to detect defects of the order of 10Ω-100Ω because the value of the coupling capacitance is too small and the impedance is too high (from several MΩ to several GΩ).
[0009] Therefore, although the non-contact-contact method in the past has many advantages, because of the characteristic of too high impedance, in fact, the plug-in probe cannot stand upright no matter what, and can only be implemented in a very narrow substrate. Therefore, , the pin probe and its fixture must have high accuracy, which becomes an obstacle to the cost reduction of the non-contact-contact method

Method used

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  • Method and apparatus for circuit board continuity test, tool for continuity test
  • Method and apparatus for circuit board continuity test, tool for continuity test
  • Method and apparatus for circuit board continuity test, tool for continuity test

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Embodiment

[0108] The following is a detailed description of further specific embodiments of the above-mentioned embodiments.

[0109] This embodiment is an inspection device for inspecting a circuit substrate on which a plurality of fine-pitch pattern lines are wired.

[0110] Figure 6 Yes, an example of the circuit board 200 to be inspected is displayed. That is, the circuit substrate 200 is wired with a plurality of pattern lines, and it is the purpose of the inspection device of the embodiment to inspect the conduction state of each pattern line. In the figure, pattern lines are laid on the substrate 200 from left to right, and the spacing between adjacent pattern lines on the left side of the substrate is set to such an extent that pin probes can stand upright. Also, the distance between the adjacent pattern lines on the right side of the substrate 200 is such that the two electrodes of the adjacent pattern lines are not in contact with each other.

[0111] Figure 7 is dedicat...

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Abstract

While decreasing the impendance of a current path to be tested on the board. Inductance and leads are connected with coupling capacitance formed on one end of a pattern to be tested on the board. The other end of the pattern is coupled to an AC test signal through a lead. Since the capacitance, the impendance and the pattern form a resonant circuit, an output signal can be detected in a low-impedance condition.

Description

technical field [0001] The present invention is, for example, an apparatus for inspecting continuity of a circuit board used when inspecting a fine wiring pattern, an inspection method, and a jig used for the inspection. Background technique [0002] As methods for inspecting circuit boards, there are pin contact and non-contact methods, which are generally known. [0003] The latch contacts are, as figure 1 As shown, at the two ends of the conductor pattern of the inspection object, put the plug probes in direct contact with each other, the plug probe at one end discharges the current, and the plug probe at the other end calculates the voltage value according to the detected voltage value. The resistance value of the conductor pattern is checked for continuity between the two ends. [0004] This pin contact method has the advantage of a high SN ratio because the pin probes are in direct contact. [0005] However, conversely, when inspecting a fine-pitch substrate, it is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/02G01R31/28H01L21/66H05K3/00G01R31/312
CPCG01R31/312G01R31/2805G01R31/2812G01R1/07G01R31/3183H03K19/1737
Inventor 山冈秀嗣
Owner OHT