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Subsupport for photoelectric module and packaging method utilizing same subsupport

A technology of photoelectric modules and auxiliary brackets, which is applied in the field of auxiliary brackets, and can solve problems such as signal distortion, signal transmission reliability, and module work reliability reduction.

Inactive Publication Date: 2006-02-08
ELECTRONICS & TELECOMM RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the general photoreceiver module having the above-mentioned structure is a photoreceiver module whose transmission speed is 2.5 Gbps or higher, there will be a problem due to adhesion on the interconnection line between the photoelectric device 102 and the electronic device (not shown). Signal distortion occurs due to the parasitic component of the wire
As a result, the reliability of signal transmission and the reliability of module work are reduced
In addition, there are certain restrictions on the additional interconnection lines mounted on the substrate 104 not being used for optical receiver modules operating at high speeds above 2.5 Gbps

Method used

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  • Subsupport for photoelectric module and packaging method utilizing same subsupport
  • Subsupport for photoelectric module and packaging method utilizing same subsupport
  • Subsupport for photoelectric module and packaging method utilizing same subsupport

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Embodiment Construction

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the preferred embodiments of the present invention can be modified into various other forms, and the scope of the present invention should not be construed as being limited to the preferred embodiments of the present invention.

[0018] figure 2 is a perspective view of a submount for a photovoltaic module according to the present invention. refer to figure 2 , the submount 200 for the photovoltaic module includes a dielectric material 210 and an interconnection 220 .

[0019] The dielectric material 210 is formed of alumina ceramic or conformal crystal, and has a polygonal shape including a front surface 211 and a bottom surface 212, where the front surface 211 and the bottom surface 212 may be disposed perpendicularly or at an angle to each other. If the dielectric material 210 is rectangular, the front surface 211 and the ...

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Abstract

A submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal is provided. The submount includes a dielectric material and an interconnection line. The dielectric material has a polygonal shape including a front face and a bottom face. The interconnection line is attached to the front face and the bottom face of the dielectric material. The interconnection line has a coplanar waveguide structure and is electrically to the opto-electronic device to output signals from the opto-electronic device.

Description

technical field [0001] The present invention relates to a submount for a photoelectric module, and a packaging method using the submount, more specifically, the present invention relates to a submount for a photoelectric module suitable for high-speed transmission, and using the submount A method for encapsulating a stent. Background technique [0002] Recently, as the demand for high-quality communication services has increased dramatically, the transmission speed of optical communication systems has become very high. Currently, it is possible to build an integrated network with ultra-high speed and wide bandwidth using photoelectric modules with a unit transmission speed of 2.5 Gbps in a system having a transmission speed of 40 to 100 Gbps by wavelength division multiplexing (WDM). However, a photoelectric module having a minimum unit transmission speed of 10 Gbps is required to improve the efficiency of the configuration of an optical communicati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L21/50H04B10/02H04J14/00G02B6/42
CPCG02B6/4274G02B6/4201H01L2224/48091H01L2924/30107H01L2924/3025G02B6/4279H01L2924/00014H01L2924/00G02B6/42
Inventor 金星一林钟元金海千
Owner ELECTRONICS & TELECOMM RES INST