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Wiring detection method for semiconductor packaged inner

A detection method and semiconductor technology, which is applied in the direction of single semiconductor device testing, semiconductor/solid-state device testing/measurement, electrical measurement, etc., and can solve the problem of not detecting the wiring method of integrated circuits

Inactive Publication Date: 2006-03-08
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, semiconductor manufacturers do not have a proper method for inspecting the wiring of 2 integrated circuits in 1 semiconductor package

Method used

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  • Wiring detection method for semiconductor packaged inner
  • Wiring detection method for semiconductor packaged inner

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Embodiment Construction

[0007] Refer below figure 1 Embodiments of the present invention are explained. exist figure 1 Among them, 1 is a TV signal processing IC for three primary color signals R, G, and B generated by demodulation of luminance signals, chrominance signals, and deflection signals of TV signals, and 2 is equipped with a CCD (closed caption) signal Decoder) 2A, CPU that sends various commands such as channel selection and picture quality adjustment to TV signal processing IC1.

[0008] 3 is a semiconductor package with built-in TV signal processing IC1 and CPU2, 4 is a first video input pin for applying an image signal being broadcasted, 5 is a second video input pin for applying an image signal from a VTR, etc., 6 8 to 8 are the pins of the semiconductor package 3 that generate the primary color signals R, G, B.

[0009] The TV signal processing IC1 and CPU2 are composed of independent semiconductor chips, and are connected inside the semiconductor package 3 . The two semiconducto...

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PUM

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Abstract

There has been no appropriate means to test connections between two integrated circuits packaged in a single semiconductor package. This invention offers a test method on internal connections in a semiconductor package housing a first integrated circuit and a second integrated circuit connected with each other, including applying a test signal to a first pin of the semiconductor package, applying the test signal from the first pin to the first integrated circuit, applying a first signal generated in the first integrated circuit from the test signal to the second integrated circuit, applying a second signal generated in the second integrated circuit from the first signal back to the first integrated circuit, leading a third signal generated in the first integrated circuit from the second signal out of the semiconductor package through a second pin of the semiconductor package and confirming connections between the first integrated circuit and the second integrated circuit by verifying the third signal led out of the semiconductor package.

Description

technical field [0001] The present invention relates to a wiring detection method inside a semiconductor package used in a TV (television) receiver, etc., and particularly relates to a semiconductor package in which two integrated circuits of a CPU (microcomputer) and a TV signal processing IC are packaged in one semiconductor package wiring detection method. Background technique [0002] In the latest TV receivers, it is possible to perform basic demodulation for displaying TV signals on the screen by two integrated circuits of a CPU and a TV signal processing IC. The TV signal processing IC is an IC for processing luminance signals, chrominance signals and deflection signals in TV signals. The CPU issues various commands such as channel selection and picture quality adjustment to the TV signal processing IC. [0003] However, ICs are wired before they are shipped by semiconductor manufacturers, and they must be tested for correct operation. The CPU and the TV signal pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/26G01R31/28G01R31/02G01R31/317
CPCG01R31/2853G01R31/26H01L22/00
Inventor 别府刚美
Owner SANYO ELECTRIC CO LTD