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Scribing device and method for fragile material substrate

A technology for brittle material substrates and scribing devices, which is applied to fine working devices, glass cutting devices, stone processing equipment, etc., and can solve problems such as difficult adjustments

Inactive Publication Date: 2006-05-10
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in order to change the shape of the laser spot LS, it is necessary to replace the lens of the optical system, etc., to adjust the focus, and further, to adjust the mode of the laser light emitted from the laser oscillator, etc., and there is a problem that these adjustments are not easy.

Method used

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  • Scribing device and method for fragile material substrate
  • Scribing device and method for fragile material substrate
  • Scribing device and method for fragile material substrate

Examples

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Embodiment Construction

[0032] Embodiments of the present invention will be described below with reference to the drawings.

[0033] Fig. 1 is a schematic configuration diagram showing an embodiment of a scribing device for a brittle material substrate according to the present invention. This scribing device, for example, is used to form a scribing line on a glass substrate 50 when cutting off a glass substrate for an FPD. As shown in FIG. direction) reciprocating slide table 12.

[0034] The slide table 12 is supported by a pair of guide rails 14 and 15 arranged in parallel in the Y direction on the upper surface of the frame 11, and the slide table 12 can slide along the respective guide rails 14 and 15 in a horizontal state. At the intermediate portion of the two guide rails 14 and 15, a ball screw 13 parallel to each guide rail 14 and 15 is provided so as to be rotated by a motor (not shown). The ball screw 13 is capable of forward rotation and reverse rotation, and the ball nut 16 is mounted o...

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PUM

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Abstract

The invention provides a scribing device for a brittle material substrate. Wherein, a plurality of laser spots are formed so as to have a plurality of intensity distribution peaks along the direction of the planned scratching line of the brittle material substrate, and the intervals and The interval between the peaks of the intensity distribution of the laser spot.

Description

technical field [0001] The present invention relates to a scribing device (scribing device) used when cutting a brittle material substrate such as a glass substrate and a semiconductor wafer used in a flat panel display (hereinafter referred to as FPD). Background technique [0002] The FPD in which a pair of glass substrates are pasted together is produced by pasting a pair of large-sized mother glass substrates together and then cutting them into predetermined sizes. When cutting the mother glass substrate, a scribe line is formed on the mother glass substrate in advance with a cutter. When a scribe line is formed with a cutter, or when the glass substrate is cut after the scribe line is formed, fine glass powder and cullet are generated, causing various problems. [0003] In order to avoid the generation of fine glass powder and glass cullet during scribing and cutting with a cutter, in recent years, a method of using a laser beam to form a scribe line has been put into ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301B28D5/00B23K26/36B25H7/04B23K26/06B23K26/067B23K26/073B23K26/40C03B33/09C03B33/10
CPCB23K26/0604B23K26/0608B23K26/067B23K26/073B23K26/40B28D5/0011B23K2103/50C03B33/091C03B33/093C03B33/09
Inventor 若山治雄
Owner MITSUBOSHI DIAMOND IND CO LTD