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Stripping film

A film and copolymer technology, which is used in the field of peeling films, can solve the problems of high fluidity of thermoplastic resins and the inability of products to be extruded uniformly enough.

Inactive Publication Date: 2006-09-13
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with release films, the product to be molded cannot be extruded uniformly enough because the flowability of the thermoplastic resin is too high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] For the release film, an ETFE film (manufactured by Asahi Glass Company, Limited, AFLEX 12N, melting point: 265° C.) with a thickness of 12 μm was used as layer A, and a PET film (Toray Industries Inc., Lumilar X44, Melting point: 265° C.) as layer C. The layer B was prepared by extruding EVA (manufactured by Tosoh Corporation, Ultracene 541L, melting point: 95° C.). Then, layer A and layer C were bonded to both sides of layer B by extrusion lamination to prepare a release film having a thickness of 57 µm. Layer B has a thickness of 20 microns.

[0060] Using this release film, the layer A side of the release film is brought into contact with a multilayer printed circuit board, and the multilayer printed circuit board is subjected to compression molding. The obtained multilayer printed circuit board was excellent in surface smoothness at the concave-convex void portion, and substantially no leakage of the adhesive prepreg was observed.

Embodiment 2

[0062] A release film having a thickness of 57 µm was prepared in the same manner as in Example 1 except that EAA (manufactured by JPO Co., Ltd., ET184M, melting point: 86° C.) was used instead of EVA as Layer B. Layer B has a thickness of 20 microns. The multilayer printed circuit board was compression molded in the same manner as in Example 1. The obtained multilayer printed circuit board was excellent in surface smoothness at the concave-convex void portion, and substantially no leakage of the adhesive prepreg was observed.

Embodiment 3

[0064] A release film having a thickness of 57 µm was prepared in the same manner as in Example 1 except that EEA (manufactured by Mitsui-Dupont Polychemicals Co., Ltd., A701, melting point: 96° C.) was used instead of EVA as Layer B. Layer B has a thickness of 20 microns. The multilayer printed circuit board was compression molded in the same manner as in Example 1. The obtained multilayer printed circuit board was excellent in surface smoothness at the concave-convex void portion, and substantially no leakage of the adhesive prepreg was observed.

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Abstract

A release film having a three-layer structure consisting of a layer A, a layer B and a layer C laminated in this order, wherein the layer A comprises a fluororesin having a melting point higher than the press molding temperature of a product to be molded, the layer B comprises a thermoplastic resin having a melting point of from 70 to 100 DEG C, and the layer C comprises a fluororesin or a non-fluororesin having a melting point higher than the above press molding temperature.

Description

technical field [0001] The present invention relates to release films for use in the manufacture of printed circuit boards and semiconductor packaging. technical background [0002] In recent years, the density of printed circuit boards has become higher. Therefore, a multilayer printed circuit board having a graduated concavo-convex shape to have a surface on which a device such as a semiconductor package is mounted is used. When laminating and molding a multilayer printed circuit board having graded cavity parts, it is not easy to apply uniform pressure to a product to be molded by conventional molding methods. [0003] JP-A-10-296765 discloses a peel-off surface film composed of three layers, wherein the thermoplastic resin used for the middle layer is brought into a molten state during molding to enhance its close contact with the product to be molded, thereby preventing Adhesive prepreg leakage from the product to be molded. However, with release films, the product t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/06B32B27/00B65D65/40B29C43/20B32B27/30B29C33/68B32B7/027B32B27/08H01L23/12H05K3/00H05K3/46
CPCB29K2027/12B32B7/02B29K2067/00H05K3/4611B29C43/203Y10T428/3154B29C33/68Y10T428/31544B32B27/08B32B7/027B32B7/06B32B2457/00
Inventor 山本哲贺屋政德
Owner AGC INC
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