Surface treatment composition and its use

A surface treatment and composition technology, applied in the field of surface treatment compositions or polishing compositions, can solve the problems of unsuitability, difficulty in preventing the formation of microprotrusions, surface defects, low surface roughness, etc.

Inactive Publication Date: 2006-11-22
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As far as the inventors are aware, in conventional two-step polishing, a wafer surface with low surface roughness can be obtained in the second stage of polishing, but the polishing removal rate used is very low, which is not suitable for practical manufacturing, and it is difficult to prevent Formation of micro-protrusions, micro-pits and other surface defects

Method used

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Examples

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Embodiment Construction

[0021] Hereinafter, the present invention will be described in detail with reference to preferred examples.

[0022] additive

[0023] The surface treatment composition or polishing composition of the present invention includes water and additives. In the polishing composition, this additive promotes polishing by chemical action as a polishing accelerator. In the surface treatment composition without abrasives, it acts as a surface treatment before polishing, or as a surface rinse after polishing. effect.

[0024] Such additives may include the following materials:

[0025] (a) alkali metal hydroxides, such as potassium hydroxide or sodium hydroxide,

[0026] (b) alkali metal carbonates, such as potassium or sodium carbonate,

[0027] (c) Alkali metal bicarbonates, such as potassium or sodium bicarbonate,

[0028] (d) quaternary ammonium salts such as tetramethylammonium hydroxide, tetraethylammonium hydroxide or tetrabutylammonium hydroxide,

[0029] (e) peroxides, such...

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PUM

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Abstract

Disclosed is a surface treatment composition for silicon wafers with a resistivity of at most 0.1 Ω·cm, which comprises water and at least one compound selected from the group consisting of alkali metal hydroxides, alkali metal carbonates, salts, alkali metal bicarbonates, quaternary ammonium salts, peroxides or peroxyacid compounds.

Description

[0001] This application is a divisional application of the patent application CN99108532.9 with the filing date of June 22, 1999 and the title of the invention being "Polishing Composition and Surface Treatment Composition". technical field [0002] The present invention relates to a surface treatment composition or a polishing composition suitable for the surface treatment of semiconductor wafers. More particularly, the present invention relates to a surface treatment composition or polishing composition which has a high polishing removal rate, and which can be obtained by using a silicon wafer containing a large amount of dopants in the wafer and having a resistivity of 0.1 Ω maximum. cm) to reduce the formation of waviness in the mirror polishing, and can obtain an extremely smooth surface. Background technique [0003] In recent years, high-integration and large-capacity high-performance semiconductor element chips for high-tech products including computers have been dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/18H01L21/304C09G1/02C09K3/14H01L21/306
CPCC09G1/02C09K3/1463H01L21/02024
Inventor 井上穣伊东真时
Owner FUJIMI INCORPORATED
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