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Radiation-curable, solvent-free and printable precursor of an adhesive

A radiation curing, adhesive technology, applied in non-polymer organic compound adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problem of shear value not meeting actual requirements

Inactive Publication Date: 2006-11-22
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shear values ​​of the cured polymers do not meet all practical requirements

Method used

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  • Radiation-curable, solvent-free and printable precursor of an adhesive
  • Radiation-curable, solvent-free and printable precursor of an adhesive
  • Radiation-curable, solvent-free and printable precursor of an adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0207] The components of Example 1 shown in Table 1 were mixed to prepare a binder precursor. The amounts of mono- and di-acrylate functional oligomers listed in Table 1 were calculated from the amounts of GENOMER 4188 or 4269. Similarly, the given amount of this acyl monomer comprises the amount of the monomers EHA and 2-acrylic acid-2(((propenyl-amino)carbonyl)oxy)ethyl ester (=GENOMER 1122) contained in GENOMER 4188 or 4269 .

[0208] The adhesive precursor was applied to a 175 micron thick polyester film at a thickness of 50 microns using a knife coater.

[0209] First, the binder precursor was partially cured using a UV dryer Natograph Ltd - UV Dryer type 90-0220-T8 (available from Natograph Ltd., Nothingham, UK; commonly used for drying and curing screen printed inks). Both sides of the polyester film (Melinex ST726 from DuPont) were primed with an acrylate primer and used as a standard sample. The energy incident on the binder precursor layer during the partial curin...

Embodiment 2-5

[0214] Example samples 2-5 were prepared and tested in the same manner as described in Example 1. The compositions of the binder precursors of Examples 2-5 are shown in Table 1. There are higher levels of acryloylmorpholine (ACMO) (Examples 2, 3 and 5) and significant amounts of difunctional polyester urethane acrylate oligomers (Examples 4 and 5). The amounts of mono- and di-acrylate functional oligomers shown in Table 1 were calculated from the amounts of GENOMER 4188 or 4269. Similarly, the given amounts of such monomers include the amounts of the monomers EHA and 2-acrylic acid-2(((acryloyl-amino)carbonyl)oxy)ethyl ester (=GENOMER 1122) contained in GENOMER 4188 or 4269.

[0215] Adhesive joints formed between two substrates were tested by the method indicated in the test method above. Table 2 shows the test results. The shear bond failure tests of Examples 2-5 show that the values ​​are all in excess of 100°C.

[0216] In a separate experiment, the binder precursor co...

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Abstract

The present invention relates to free radiation curable, solvent-free, printable adhesive precursors comprising: (i) 15 to 60% by weight of one or more mono(meth)acrylate functional low Polymeric compounds, at least one of said oligomeric compounds comprising at least one urethane linkage; (ii) 5-85% by weight of one or more multi-(meth)acrylate functional oligomeric compounds; (iii) 5 - 45% by weight of one or more monomeric compounds containing one ethylenically unsaturated group; (iv) 0-10% by weight of one or more monomeric compounds containing 2 or more ethylenically unsaturated groups and (v) an effective amount of one or more free radical photoinitiators; wherein, each percentage is selected so that the precursor is at 20°C and 100s -1 The dynamic viscosity at the shear rate is 300-15000 mPa.s, and the above percentages are percentages by weight based on the mass of the precursor.

Description

field of invention [0001] The present invention relates to free radiation curable, solvent-free and printable binder precursors. The invention also relates to an adhesive prepared by UV curing said precursor and a method of mounting a first substrate and a second substrate by said precursor. Background of the invention [0002] Pressure sensitive adhesives can be applied to substrates as pre-cured tapes, which can be die cut to the desired shape. While this technique is convenient for many technical applications and usually does not require any in-situ curing step, it has drawbacks in other technical applications for the following reasons: [0003] • Double-sided tape typically requires the use of one or more release liners, which are discarded when the tape is used. When die-cutting the tape to the desired shape, also discard the excess tape. [0004] ·Especially in the electronics industry, the shape of the substrate to be pasted will be smaller and more complex, so die...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/06C08F290/06C09J175/16C08G18/28B05D1/38B05D3/06B05D7/24C09J4/00
CPCC08F290/06C08F290/067C09J175/16
Inventor A·H·格雷晨S·R·戈布
Owner 3M INNOVATIVE PROPERTIES CO