Element mounting system and mounting method

Abstract

A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.

Description

technical field [0001] The present invention relates to a component mounting system and a mounting method for mounting components such as electronic components on a substrate, for example. Background technique [0002] In recent years, with the miniaturization of electronic components such as semiconductors and the high density of mounting, the positional accuracy when mounting components on substrate electrodes is also improving. For example, in small devices such as mobile phones, which have been widely spread in recent years, many components with a small size of about 0.6 mm×0.3 mm are mounted at a narrow pitch of about 0.1 mm. When mounting such components, extremely high mounting position accuracy is required. [0003] When mounting components of such a small size as described above, special consideration is required for the management of the mounting quality. That is, in order to ensure the quality of the manufactured mounting substrate so that it can be used normall...

AI Technical Summary

Problems solved by technology

[0007] However, so far, it is not possible to understand the deterioration state of some parts of such a mechanism with clear indicators. Only skilled operators find any abnormality in the operating state of the device to judge whether it is a precursor of component deterioration and decide whether to carry out maintenance.

Therefore, in the case of an abnormal operation that cannot be known in advance, by the time of discovery, a large number of defective products have often been produced, and a large loss has to be suffered, and emergency maintenance work has to be carried out.

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